Bamtone MCT Series Multi-channel Copper Thickness Testing System

1、Product Introduction：

Bamtone MCT series multi-channel copper thickness testing system is a test system integrating multiple channels of surface copper testing, which takes into account the test accuracy and economy, and can be quickly adapted to online copper thickness testing equipment to achieve multi-channel copper thickness testing.

2、Instrumentation principles：

   The Bamtone MCT Series Multi-Channel Copper Thickness Testing System employs micro-resistance measurement technology. Utilizing four contact probes, it generates electrical signals on the copper foil surface for measurement. When contacting the copper foil sample, a constant current flows through the outer two probes while the inner two probes detect voltage variations. According to Ohm's Law, the voltage value is converted into resistance, and through specific mathematical functions, thickness values are calculated. This method remains unaffected by insulating board layers or copper layers on the backside of circuit boards.

3、range of use ：

This precision instrument measures copper layer thickness and is widely used in electronics, telecommunications, automotive, and related industries. In the electronics sector, copper thickness serves as a critical factor affecting circuit performance and reliability. Therefore, accurate measurement of copper layer thickness plays a vital role in product development and quality control during manufacturing. The device enables rapid and precise measurement of copper layers across various materials, providing robust support for product innovation and production quality assurance.

4、Product features：

1) Two-point calibration and multi-point calibration can be selected to achieve accurate measurement of copper thickness over a large range without switching files.

2) Multiple channels are measured at the same time, and there is no interference between the channels.

3) The standard machine has 2 or 6 channels, and the number of other channels can be selected as required.

4) The modular design is adopted to increase the channel and add the copper thickness module without replacing the machine.

5) The instrument uses tungsten steel probe, which is wear-resistant and can reach 500,000-1.5 million times service life.

6) Open communication protocol, flexibility and control of computer connections, using USB interface connection.

7) Operation is simple and convenient, performance is stable, test is accurate.

8) Provide SDK development kit, currently only supports C++.

9) Provide test software and develop sample programs.

5、Technical indicators and parameters：

Ø test specification ：0.2-254μm

Ø Channel number: standard machine 2 channel/6 channel optional, other number of channels can be optional.

Ø Unit: Data shows that the unit can be selected μm.

Ø Operation language: there are English and Chinese in the instrument operation interface.

Ø Calibration method: two-point calibration or multi-point calibration, no need to switch test files.

Ø Test mode: single or continuous measurement mode can be selected.

Ø power pack： AC 220V

Ø data interface：USB

Ø Test accuracy: ±3% (according to the standard sheet), test product is ±5%, with temperature sensing.

Ø Test speed: 1S/once

Ø minimum resolution：0.01um

Ø Measurement error: within 5% of the relative standard plate;

Ø Probe wire length: 1.5-2.5 meters optional

Ø Host size：256*200*120mm