Guizhou Yuanmiao Automation Equipment Co., Ltd.: 1Yr

Anshun, Guizhou, China; Main products: ABB Triconex Foxboro LAM, Bentley Motorola Schneider, Kollmorgen HIMA ALSTOM, Reliance GE HONEYWELL NI、ICS

Home
Product Categories

ABB

Bently Nevada

TRICONEX

GE

ICS Triplex

HIMA

MOTOROLA

WOODWARD

HONEYWELL

Foxboro

Schneider Modicon

YOKOGAWA

EPRO

MOOG

Westinghouse

Reliance

Emerson

B&R

ALSTOM

LAM

KONGSBERG

FANUC

National Instruments

Kollmorgen

Other Brands

Rexroth

PROSOFT

Vibro-meter

Allen-Bradley

ZYGO

Praxis

METSO

Basler Electric

A-B

XYCOM

AMAT

TOSHIBA

CCC
Company Profile

Company Introduction

Photo Gallery
Blog
Quality Control
Contact Us

Home > Products > Other Brands > SHINKAWA VM-5Z4 Machine Protection Monitor

SHINKAWA VM-5Z4 Machine Protection Monitor

FOB Price

Negotiable / Piece

1 Piece(Min. Order)

Payment TermsT/T PayPal Western Union

Request Sample Customized Request Request Free Catalogs

Contact Now

Get lowest price

Product Details

Material	Other, Global universal model	Condition	Other, Global universal model
Task	Other, Global universal model	Mathematical Model	Other, Global universal model
Signal	Other, Global universal model	Customized	Non-Customized
Structure	Other, Global universal model

Product Description

SHINKAWA VM-5Z4Comprehensive Analysis of SHINKAWA VM-5Z4I. Overview

The SHINKAWA VM-5Z4 is a high-precision visual inspection equipment for advanced semiconductor packaging and micro-assembly, focusing on 3D topography analysis and ultra-micro defect recognition. The equipment integrates laser interferometry, structured light scanning, and deep learning algorithms to enable sub-micron-level inspection of 3D parameters such as solder ball coplanarity, wire bond height, and packaging warpage after chip packaging. It also supports automated recognition of 2D defects including surface cracks, contaminants, and wire bond misalignment. Designed for high-density packaging scenarios such as flip chips, BGA, and CSP, it is compatible with wafer-level, substrate-level, and single-chip inspection, widely used in semiconductor packaging testing, advanced packaging R&D, and reliability verification production lines to meet quality control needs for high-end products like 5G chips, automotive electronics, and AI chips.

II. Functional Features

Ultra-Precision 3D Inspection Capability
Equipped with a laser interferometer and high-speed 3D scanning module, the 3D height inspection accuracy reaches ±0.3μm, capable of real-time generating 3D point cloud maps of surface topography to precisely analyze solder ball height differences, wire bond arc deviations, and packaging warpage (minimum recognizable height change of 1μm).
Multi-Modal Optical Inspection System
Integrates brightfield, darkfield, polarized light, and coaxial light sources (supporting UV/IR band expansion), combined with a 12MP high dynamic range camera, achieving 2D inspection accuracy of ±0.8μm to adapt to defect imaging on surfaces of different materials such as metal, ceramic, and molding compound.
AI-Driven Intelligent Inspection
Built-in deep learning defect classification module (supporting CNN and Transformer architectures) can autonomously learn complex defect features such as missing solder balls, wire bond fractures, and pad contamination, with a defect recognition rate exceeding 99.5% and false detection rate <0.1%.
High-Speed Automation Integration
Adopts linear motors and DD motor-driven stages, with a maximum inspection speed of 6,000 pieces/hour (standard BGA chips), supporting seamless docking with robotic arms and automatic loading/unloading systems to adapt to fully automated production lines.
Intelligent Data Management and Process Optimization
Generates real-time 3D inspection reports (including CPK statistics and defect distribution heat maps), supports docking with factory MES and SPC systems, and assists in packaging process optimization by tracing process deviations through big data analysis.
Human-Machine Collaborative Operation Interface
A 17-inch touchscreen combined with graphical programming tools supports drag-and-drop editing of inspection processes, real-time image preview, and dynamic parameter adjustment. Built-in automatic calibration modules (laser power, 3D coordinate system, camera calibration) reduce the operation threshold.

III. Technical Parameters

Parameter Category	Specific Indicators
Inspection Range	X/Y axis: 300mm×300mm, Z axis: 100mm (3D scanning), θ axis: ±360° rotation
Optical System	- Camera: 12MP monochrome/color CMOS, frame rate ≥30fps - Lens: Motorized zoom (10-500X), automatic depth of field adjustment - Light source: Five-channel LED (UV/blue/green/red/white), supporting multi-angle combined illumination
Inspection Accuracy	2D plane: ±0.8μm (3σ), 3D height: ±0.3μm, repeat accuracy: ±0.2μm
Chip Size	Minimum: 0.05mm×0.05mm, maximum: 50mm×50mm, thickness: 0.05-5mm
Packaging Types	Flip chips, BGA, CSP, FC-BGA, WLCSP, ceramic packaging, power device packaging (e.g., IGBT), etc.
Motion System	Driven by linear motors + DD motors, positioning accuracy ±1μm, maximum acceleration: 3G, motion speed ≤500mm/s
3D Inspection Technology	Laser triangulation, white light interferometry, structured light scanning (optional phase shift technology)
Data Processing	Image processing speed: ≤15ms/frame, AI model inference delay: ≤50ms (single chip), supporting edge computing node expansion
Power Supply and Air Source	Power supply: Three-phase AC 220V±10%, 50/60Hz, power consumption ≤4kW Compressed air: 0.6-0.8MPa
Working Environment	Temperature: 23±2℃, humidity: 40%-60% (non-condensing), cleanliness: Class 100 (ISO 5)

IV. Working Principle

The core inspection process of VM-5Z4 is based on the technical framework of "3D modeling - intelligent analysis - automated execution":

Workpiece Positioning and 3D Modeling

Fix the workpiece via vacuum adsorption or mechanical clamping. The vision system captures global images to determine coordinates, and the stage moves to the inspection position.
The laser emitter projects structured light or interference fringes onto the workpiece surface, and the camera collects deformed fringe images to generate 3D point clouds through phase resolution (minimum point spacing of 0.5μm).

Multi-Modal Data Acquisition

Switch light source modes according to inspection needs (e.g., darkfield to highlight crack edges, polarized light to reduce reflection interference), and capture 2D grayscale images and 3D height maps.
Perform multi-view scanning on key areas such as solder balls and wire bonds to obtain complete 3D topography data.

AI-Driven Defect Recognition

2D defect inspection: Identify surface defects through edge detection, template matching, and deep learning models (e.g., YOLOv8).
3D parameter analysis: Calculate parameters such as solder ball height differences, wire bond arcs, and packaging warpage based on 3D point clouds, and judge by comparing with standard thresholds.
Automatically mark abnormal data (e.g., out-of-tolerance solder balls highlighted in red).

Automated Decision-Making and Data Management

The system automatically determines workpiece qualification according to preset standards, classifies and records defect types (e.g., critical defects, warning defects).
Store inspection data in real-time in the database, supporting retrieval and statistical analysis by batch, model, defect type, and other dimensions.

V. Common Faults and Solutions

Fault Phenomenon	Possible Causes	Solutions
Large deviation in 3D inspection data	1. Fluctuation in laser emitter power 2. Failure of 3D sensor calibration parameters 3. Abnormal workpiece surface reflection	1. Calibrate laser power and replace aging modules 2. Perform full parameter calibration of the 3D system (Z-axis height + flatness) 3. Add anti-reflective coatings or adjust polarizer angles
AI defect missed detection	1. Insufficient training dataset 2. Improper setting of inspection threshold 3. Insufficient light source contrast	1. Supplement defect samples and retrain the model 2. Optimize the threshold (e.g., increase recall rate) 3. Adjust light source angle or wavelength (e.g., blue light to enhance metal defect contrast)
Unusual noise during stage motion	1. Insufficient guide rail lubrication 2. Motor encoder failure 3. Loose mechanical structure	1. Clean guide rails and apply special lubricant 2. Detect encoder signals and replace faulty components 3. Tighten transmission components and check for foreign object interference
Blurred camera imaging	1. Lens focus offset 2. Camera sensor contamination 3. Unstable light source brightness	1. Perform automatic focusing or manual focus calibration 2. Clean the lens and sensor with a dust-free cloth 3. Replace the light source driver board and calibrate brightness compensation parameters
System software crash	1. Data cache overflow 2. Driver program conflict 3. Hardware compatibility issue	1. Clear the cache and restart the software 2. Upgrade the driver to the official latest version 3. Check motherboard and peripheral compatibility, and reinstall the system if necessary
Laser safety alarm	1. Laser protective cover not closed 2. Laser power exceeding the safety threshold 3. Sensor false trigger	1. Confirm the status of the protective cover and reset 2. Reduce laser power to the safe range 3. Calibrate the sensor position and replace the faulty probe

VI. Technical Difference Comparison with VM-5P3 (Extended Supplement)

Comparison Dimension	VM-5Z4	VM-5P3
Core Positioning	High-end 3D inspection (precise analysis of solder balls/wire bonds)	General 2D+3D inspection (focus on surface defects)
3D Inspection Accuracy	±0.3μm (height)	±0.5μm (height)
Optical Configuration	12MP camera + 500X zoom lens	10MP camera + 300X zoom lens
AI Function	Built-in deep learning model (supports custom training)	Optional AI module (basic defect classification)
Inspection Speed	6,000 pieces/hour (standard chips)	4,000 pieces/hour (standard chips)
Application Scenarios	Advanced packaging (flip chips, FC-BGA), high-reliability products (automotive electronics, military)	Conventional packaging (QFP, BGA), medium-batch production
Price Positioning	High-end model (higher cost)	Cost-effective model (moderate cost)

Company Profile

Guizhou Yuanmiao Automation Equipment Co., Ltd.

Main products: Covering globally renowned brands: Bently Nevada, Triconex, Woodward, Foxboro, Westinghouse, Reliance, Schneider Modicon, ABB, AB (Allen-Bradley), Motorola, GE Fanuc, Yaskawa, Bosch Rexroth Rexroth, ACSO, YOKOGAWA, Rexroth, NI, ICS Triplex, Kollmorgen, Mitsubishi, MOOG, Emerson, B&R B&r, SST, ALSTOM, KUKA EPRO, LAM HIMA dark Horse, HONEYWELL, prosoft, AMAT, SIEMENS, etc. The product categories include: DCS system accessories, robot system spare parts, large servo system spare parts, etc., which are widely used in power, chemical, metallurgy, intelligent manufacturing and other fields.

Contact Us

Guizhou Yuanmiao Automation Equipment Co., Ltd.: Contact nameyezi
Chat Now; AddressXixiu District, Anshun, Guizhou

*Email
Please enter Your valid email address.
*To

yezi
*Message
Your inquiry content must be between 20 to 5000 characters.
Please enter a correct verification code.

Product Categories

ABB	Bently Nevada	TRICONEX	GE
ICS Triplex	HIMA	MOTOROLA	WOODWARD
HONEYWELL	Foxboro	Schneider Modicon	YOKOGAWA
EPRO	MOOG	Westinghouse	Reliance
Emerson	B&R	ALSTOM	LAM
KONGSBERG	FANUC	National Instruments	Kollmorgen
Other Brands	Rexroth	PROSOFT	Vibro-meter
Allen-Bradley	ZYGO	Praxis	METSO
Basler Electric	A-B	XYCOM	AMAT
TOSHIBA	CCC

Find Similar Products By Category: Electrical & Electronics > Electrical Control System

Product Tags:

SHINKAWA | VM-5Z4

SHINKAWA VM-5Z4 Machine Protection Monitor

You May Like

Product Details

Product Description

Company Profile

Contact Us

Product Categories

New Products

Find Similar Products By Category

Product Tags: