Dongguan Ziitek Electronical Material and Technology Ltd.: Dongguan, Guangdong, China; Main products: Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler

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Two Components 1.0W/MK Thermally Conductive Potting Compound Low Temperature Cured Potting

FOB Price

Negotiable / Kilogram

1 Kilogram(Min.Order)

Supply Ability 1000000 Kilogram / Kilograms per Month
Port Dongguan
Payment TermsT/T
Delivery Detail3 days

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Product Details

Brand Name	Ziitek		Place of Origin	China
Model Number	TIS680-10AB

Product Description

Two Components 1.0W/MK Thermally Conductive Potting Compound Low Temperature Cured Potting

TIS™ 680-10AB Series is a two-component, high thermal conductive, low temperature cured, long pot life, fire resistant Silica encapsulant glue. lt is design for potting of capacitors and electrical devices.Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

Features

> Good thermal conductive: 1.0W/mK

> Excellent insulation and smoothly sourface.

> Low shrinkage

> Low viscosity, expediting air releaseed.

> Excellent in solvents and water proof.

> Longer life time.

> Excellent thermal shock efficiecy and impact resistance

Application

>To potting LED Lighting heat spreader and power- driver.
>Ferrite cements; tip type LED; good cementation to aromatic polyester

>Relay sealant; Good adhesion to rubber, ceramics, PCB and plastics

>Power transformers and coils; Potting capacitors; Potting of small electrical devices
>Adhesion to metal glass and plastic;LCD & substrates adhesion; Coatingand sealant; Coil ; IGBTS;Transformer; Fire retardant
>Optical / medical component adhesive

Typical Properties of TIS™ 680-10AB Series
Typical Uncured Material
TIS^TM680-10A(Hardener)		Mixing ratio (weight ratio)
Color	white	A:=1 :1
Viscosity @25℃ Brookfield	3500 mPa.s	Viscosity @25℃ Brookfield	3500 mPa.s
specific Gravity	1.73g/cc³	specific Gravity	1.73g/cc³
Shelf life @25℃ in sealed container	6 months	Working pot life(250g @25℃)	30 mins
TIS^TM680-10B(Resin)		Cure Schedule
Color	white	Cure at 25C	3 hrs
Viscosity @25℃ Brookfield	3500 cPs
Shelf life @25℃ in sealed container	6 months	Cure at 7o°c	20 mins
Cured Properties		Value	Test method
Hardness (Shore A)@25℃		65	ASTM D2240
Operating temperature		-40℃ ~160℃	******
Glass transition temperature Tg		92℃	******
Elongation		4.50%	ASTM D412
Coefficient of thermal expansion, /℃		3.0x 10^(-5)	******
Fire resistance uL		94 V-0	E331100
Moisture absorption % wt gain 24 hours water immersion @25℃		<0.1	ASTM D570
Thermal Conductivity		1.0W/m-K	ASTM D5470
Thermal Impedance @10psi		0.48℃*in²/W	ASTM D5470
Dielectric Breakdown Voltage		200 volts / mil	ASTM D149
Dielectric Constant@1MHz		4.5	ASTM D150
volume resistivity, ohm-cm @ 25℃		3.0x 10^13	ASTM D257

Product packaging

1KG A/B for each tank.

5KG A/B each.

10KG A/B each.

Company profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

Contact Us

Dongguan Ziitek Electronical Material and Technology Ltd.: Contact nameMiss. Sophia
Chat Now; Phone86-181-53789196; AddressBuilding B8, Industry District 2,Hengli Town, Dongguan, Guangdong

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Product Categories

Double Sided Thermal Tape	Phase Changing Materials	Silicone Foam Material	Thermal Adhesive Tape
Thermal Conductive Putting	Thermal Conductive Grease	Thermal Conductive Pad	Thermal Conductive Plastic
Thermal Gap Filler	Thermal Graphite Sheet	Thermal Insulation Materials	silicone-free thermal gap pad
Thermally Conductive Gel	Thermal Epoxy Glue

Two Components 1.0W/MK Thermally Conductive Potting Compound Low Temperature Cured Potting

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