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Help CenterTwo Components 1.0W/MK Thermally Conductive Potting Compound Low Temperature Cured Potting
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Two Components 1.0W/MK Thermally Conductive Potting Compound Low Temperature Cured Potting
TIS™ 680-10AB Series is a two-component, high thermal conductive, low temperature cured, long pot life, fire resistant Silica encapsulant glue. lt is design for potting of capacitors and electrical devices.Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
Features
> Good thermal conductive: 1.0W/mK
> Excellent insulation and smoothly sourface.
> Low shrinkage
> Low viscosity, expediting air releaseed.
> Excellent in solvents and water proof.
> Longer life time.
> Excellent thermal shock efficiecy and impact resistance
Application
>To potting LED Lighting heat spreader and power- driver.
>Ferrite cements; tip type LED; good cementation to aromatic polyester
>Relay sealant; Good adhesion to rubber, ceramics, PCB and plastics
>Power transformers and coils; Potting capacitors; Potting of small electrical devices
>Adhesion to metal glass and plastic;LCD & substrates adhesion; Coatingand sealant; Coil ; IGBTS;Transformer; Fire retardant
>Optical / medical component adhesive
| Typical Properties of TIS™ 680-10AB Series | |||
| Typical Uncured Material | |||
| TISTM680-10A(Hardener) | Mixing ratio (weight ratio) | ||
| Color | white | A:=1 :1 | |
| Viscosity @25℃ Brookfield | 3500 mPa.s | Viscosity @25℃ Brookfield | 3500 mPa.s |
| specific Gravity | 1.73g/cc³ | specific Gravity | 1.73g/cc³ |
| Shelf life @25℃ in sealed container | 6 months | Working pot life(250g @25℃) | 30 mins |
| TISTM680-10B(Resin) | Cure Schedule | ||
| Color | white | Cure at 25C | 3 hrs |
| Viscosity @25℃ Brookfield | 3500 cPs | ||
| Shelf life @25℃ in sealed container | 6 months | Cure at 7o°c | 20 mins |
| Cured Properties | Value | Test method | |
| Hardness (Shore A)@25℃ | 65 | ASTM D2240 | |
| Operating temperature | -40℃ ~160℃ | ****** | |
| Glass transition temperature Tg | 92℃ | ****** | |
| Elongation | 4.50% | ASTM D412 | |
| Coefficient of thermal expansion, /℃ | 3.0x 10^(-5) | ****** | |
| Fire resistance uL | 94 V-0 | E331100 | |
| Moisture absorption % wt gain 24 hours water immersion @25℃ | ASTM D570 | ||
| Thermal Conductivity | 1.0W/m-K | ASTM D5470 | |
| Thermal Impedance @10psi | 0.48℃*in²/W | ASTM D5470 | |
| Dielectric Breakdown Voltage | 200 volts / mil | ASTM D149 | |
| Dielectric Constant@1MHz | 4.5 | ASTM D150 | |
| volume resistivity, ohm-cm @ 25℃ | 3.0x 10^13 | ASTM D257 | |
10KG A/B each.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
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