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High Conductivity Thermal Epoxy Glue For Bonding Electronics Solvent Resistance

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US$ 1 - 35 MOQ: 5 Kilograms
Key Specifications
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Brand Name:
ZIITEK
Place of Origin:
China
Model Number:
TIE™380-25 Thermal Epoxy Glue
Payment & Shipping
Payment Methods:
Port of Shipment:
Dongguam
Delivery Detail:
3 days
Brand Name ZIITEK
Place of Origin China
Model Number TIE™380-25 Thermal Epoxy Glue
Type Thermal Conductive Glue
EINECS No. TIE™380-25 Thermal Epoxy Glue
Other Names Thermal Epoxy Glue
CAS No. TIE™380-25 Thermal Epoxy Glue
Classification Other Adhesives
Usage Other, cooling
Main Raw Material Other, Epoxy Glue

High Conductivity Thermal Epoxy Glue For Bonding Electronics Solvent Resistance


Product Summary:

 

TIE™380-25  is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling

 

Feature

 

Outstanding thermal performance 2.5W/mK
High tack surface reduces contact resistance
RoHS compliant
UL recognized
Fiberglass reinforced for puncture, shear and tear resistance
Easy release construction

 

Applications

 

Heat pipe thermal solutions
Memory Modules
Mass storage devices
Automotive electronics
Set top boxes
Audio and video components
IT infrastructure
GPS navigation and other portable devices
 
Typical Properties of TIETM380-25
Chemical type Epoxy Test Method
Appearance uncured Gray Paste Visual
Appearance cured Dull Gray Solid Visual
Components One Component *****
Heat Capacity 0.7 l/g-K ASTM C351
Key Substrates Metals, ceramics *****
Hardness 92 Shore A ASTM 2240
Continuous Use Temp -40 to 180℃ *****
Tensile strength Al/Al @25°C >2800psi *****
Thermal Conductivity 2.5 W/m-K ASTM D5470

 

Application Features:TIE™380-25

 

Color Gray

Viscosity@25℃ 140,000 cPs

Specific Gravity@25℃ 2.1 g/cc

Shelf life @25℃° 10 Days

@0℃° 6 Months

(Storage methods and temperature will affect the shelf life)

 

Curing procedures:

Curing temperature Curing time


100℃° 3 Hours

125℃ 1.5 Hour

150℃ 20 Minutes

170℃ 5 Minutes

 

Package:

1kg/can

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.


Product Tags: Thermal Conductive Glue , Thermal Epoxy Glue , thermal conductive gap filler

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Verified Business License
Business Type
Manufacturer
Year Established
2006
Factory Size
3,000-5,000 square meters
Total Employees
201 - 300 People