Low Melting Point Thermal Conductive Phase Changing Material

TCP820P Low Melting Point Thermal Conductive Phase Changing Material

The TIC™820P series is low melting point thermal interface material. At 50℃, TIC™820P series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.

TIC™820P series is a flexible solid at room temperature and free standing without reinforcing components that reduce thermal performance.

TIC™820P Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration(pump out)at operating temperatures.

Features

> 0.183℃-in²/W thermal resisitance

> Naturally tacky at room temperature,no adhesive required
> No heat sink preheating required

Applications

> Automotive electronics
> Set top boxes
> Set top boxes
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices
> CD-Rom, DVD-Rom cooling

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.