High-Voltage Silicone Thermal Pad Insulation Material Heat Conduction Sheet For Efficient Heat Transfer
High-Voltage Silicone Thermal Pad Insulation Material Heat Conduction Sheet For Efficient Heat Transfer
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Products description
TIF®100-30-11S Series is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.
Features:
> Excellent thermal conductivity 3.0W/mK
> Naturally tacky needing no further adhesive coating
> High compliance adapts to various pressure application environments
> Available in different thickness options
Applications:
> Cooling components to the chassis of frame
> Heat dissipation structure for radiators
> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles
> LED TV and lamps
| Typical Properties of TIF®100-30-11S Series | ||
| Color | Gray | Visual |
| Construction & Compostion | Ceramic filled silicone | ***** |
| Specific Gravity | 3.0 g/cc | ASTM D792 |
| Thickness | 0.02~0.20inch(0.50~5.0mm) | ASTM D374 |
| Hardness | 45 (Shore 00) | ASTM 2240 |
| Continuos Use Temp | -40 to 200℃ | ****** |
| Dielectric Breakdown Voltage | ≥5500 VAC | ASTM D149 |
| Dielectric Constant | 5.0MHz | ASTM D150 |
| Volume Resistivity(Ohm-cm) | >1.0*1.012 | ASTM D257 |
| Fire rating | 94 V0 | UL (E331100) |
| Thermal conductivity | 3.0W/m-K | ASTM D5470 |
Product Specification
Standard Thickness: 0.02"(0.50 mm)-0.20" (5.00 mm) with increments of 0.01" (0.25 mm).
Standard Size: 16"X16" (406 mmX406 mm).
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
FAQ
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge
Contact us:
Mor information, please contact us: sales26@ziitek.com
Send Inquiry to This Supplier
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