TIATM800 Series products are mostly used for bonding heatdissipation fins, microprocessors and other power consumption semiconductors.This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can and mechanical fixing.
Feature
》Thermal Conductivity 0.8W/mK
》High performance thermally conductive acrylic adhesive.
》High bond strength to a variety of surfaces。
》Double sided pressuresensitive adhesive tape.
Application
》Mount heat sink onto BGA graphic processor or drive processor.
》Mount heat spreader onto powerconverter PCB or onto motor control.
》Can be used instead of heat cureadhesive,screwmounting or clip mounting.
| Typical Properties of TIA™800FG Series | |||||||
| Product Name | TIATM805FG | TIATM806FG | TIATM808FG | TIATM810FG | TIATM815FG | TIATM820FG | Test Method |
| Color | White | Visual | |||||
| Adhesive Type | Acrylic Adhesive | ******** | |||||
| Backing Type | Glass fiber | ******** | |||||
| Composite Thickness | 0.005" 0.127mm | 0.006" 0.152mm | 0.008" 0.203mm | 0.010" 0.254mm | 0.015" 0.381mm | 0.020" 0.508mm | ASTM D374 |
| Aluminum Foil Thickness | ±0.001" ±0.025mm | ±0.001" ±0.025mm | ±0.0012" ±0.03mm | ±0.0012" ±0.03mm | ±0.0015" ±0.038mm | ±0.002" ±0.05mm | ASTM D374 |
| Voltage Breakdown | > 2000 Vac | > 2000 Vac | > 2300 Vac | > 3000 Vac | > 3500 Vac | > 3500 Vac | ASTM D149 |
| Peel Adhesion | 1200 g/inch2 | JIS K02378 | |||||
| Holding Power 25℃/Days | > 120 kg/inch2 | JIS K023711 | |||||
| Holding Power 120℃/Hours | > 10 kg/inch2 | JIS K023711 | |||||
| Recommend Using Pressure | 10 psi | ******** | |||||
| Thermal Conductivity | 0.8 W/mK | ******** | |||||
| Thermal Impedance@50psi | 0.52℃-in²/W | 0.59℃-in²/W | 0.83℃-in²/W | 0.91℃-in²/W | 1.15℃-in²/W | 1.43℃-in²/W | ASTM D5470 |
Standard Thicknesses:
0.005"(0.127mm),0.006"(0.152mm),0.008"(O.203mm),0.010"(O.254mm),
0.012"(0.304mm),0.015"(0.381mm),0.020"(0.508mm)
Consult the factory alternate thickness.
Standard Sizes:
16" x 100(406mm x 30.48M)Individual die cut shapes can be supplied.Reinforcement:
TIATM800FG Series rolls type can add with fiberglass reinforced.
Company profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
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