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Help CenterGerman Technical Background VOK-P 9065 Processing Aids It Has Release Performance Replaces BYK-P 9065
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German technical background VOK®- P 9065 Processing aid for low shrinkage SMC/BMC with demoulding property.
Product Information
chemical composition
Mixture of surfactant and polymer
Typical Physicochemical Data
The data given in this data page are only typical values, not technical indicators of the product.
Acid value: 142 mg KOH/g
Density (20 ° C): 0.95 g/ml
Refractive index (20 ° C): 1.48
Non volatile matter (10 minutes, 150 ° C):>97%
Flash point:>100 ° C
application area
SMC, BMC
Features and Benefits
VOK®- P 9065 is a low shrinkage LS-SMC/BMC processing aid with demoulding property. It can completely replace the traditional zinc stearate and simplify the operation of raw materials. Avoid phase separation of LS-SMC/BMC and reduce wire drawing. The defect rate will also be reduced due to shrinkage and warpage, high gloss, low fog shadow and improvement of color uniformity, and high surface appearance products will be obtained. If the product needs post coating or bonding, VOK®- P 9065 can be firmly anchored in the cured resin without migration to the surface. The cost is balanced by low usage.
Standard application
SMC (LS)
BMC/DMC
VOK®- P 9065 is recommended for low shrinkage LS-SMC systems.
Recommended dosage
2-2.5% (purchase form) is based on the total amount of resin; The specially high filling system can reach 4%.
The above is the recommended dosage guidance. Good dosage can be obtained through a series of laboratory tests.
Addition method and processing guidance
The auxiliary agent shall be added while stirring after the UP resin and the low shrinkage (LS) component are evenly mixed. The traditional release agent used in the formula should be removed.
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