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Help CenterSilicon Grinding Wheels/Silicon Wafer Back Grinding Wheels
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PRODUCT DETAILS
Description:
Silicon grinding wheels are mainly used for trimming of silicon wafer. These products produced by our institute,which possess superior grinding performance and high cost performance,are among the top level worldwide.
Application:
Back thinning, grinding and fine grinding of apphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.
Applicable Grinding Machine:
The back grinding wheels can be used for the Japanese ,German, American, Korean and other grinders . Such as Okamoto , Disco, Strasbaugh and others grinding machine.
Advantages:
1.High efficiency
2.High precision
3.Easy processing
DRAWING&SPECIFICATION
Model |
D (mm) |
T (mm) |
H (mm) |
|
6A2/6A2H |
175 |
30, 35 |
76 |
200 |
35 |
76 |
|
350 |
45 |
127 |
|
|
6A2T |
195 |
22.5, 25 |
170 |
280 |
30 |
228.6 |
|
|
6A2T(three ellipses) |
350 |
35 |
235 |
209 |
22.5 |
158 |
|
Other specifications can be produced according to customers’ requirement. | |||
If you need any products, do not hesitate to contact
Skype:Annawng
WhatsApp:+8615617785923
@moresuperhard.com
Send Inquiry to This Supplier
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