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Maskless lithography machine Model: DS-2000/14
1. Technical features
Uses DMD as a digital mask with a pixel of 1024 × 768
Uses a 14x reduction projection lithography objective lens for imaging, and the single exposure area is about 1mm×0.75
Uses the patented technology - building block misaligned fly-eye lens to achieve uniform illumination.
Uses imported precision gratings, imported motors, imported guide rails, and imported lead screws to achieve precise workpiece positioning and exposure stitching, and can adapt to 100×100mm substrates.
Uses a CCD focus detection system to achieve full-field leveling, automatic field-by-field focusing or automatic field selection focusing exposure.
Has an alignment function
2. Technical parameters
Light source: 350W spherical mercury lamp (exposure spectral line: i-line);
Illumination uniformity: ±2%;
Objective lens magnification: 14x
Exposure field area: 1mm×0.75mm
Lithography resolution: 1 μm
Workpiece stage movement range: X: 100mm, Y: 100mm;
Workpiece stage movement positioning accuracy: ±0.65μm;
Focusing stage movement sensitivity: 1μm;
Alignment accuracy: ±2μm;
Focusing stage movement stroke: 6mm
Focus detection: CCD detection, detection accuracy 2 microns
Rotating stage stroke: ±6° or more
Substrate size Outer diameter: Ф1mm—Ф100mm, Thickness: 0.1mm--5mm
3. Overall dimensions: 840mm (length) × 450mm (width) × 830mm (height)
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