Photolithography Machine, Xinyouyan Ure-2000/35 uv Photolithography Machine, 365ni uv Photolithography Effect
Domestically exported lithography machines, key recommended products
URE-2000 series UV lithography machines
Model: U2000/35
Brief introduction: Lithography machine: (English name: Mask ALIGENER), also known as exposure machine, This model of lithography machineinnovatively uses three flexible fulcrums to achieve high-precision automatic leveling; automatic exposure with vacuum contact; automatic control of sample lifting, leveling, contacting, exposure, and resetting; uses patented technology of building block misaligned fly-eye lenses to achieve high-uniform illumination; can continuously set the separation gap; uses a binocular dual-field microscope to achieve high alignment accuracy. The whole machine has the characteristics of reliable performance, convenient operation, and high degree of automation.
I.Technical features —— very suitable for factories (high efficiency, foolproof operation, automatic type)
For teaching and scientific research in universities (good reliability and convenient demonstration)
Adopt patented technology —— the smooth diffraction effect of the misaligned fly-eye lens of building blocks and achieve uniform illumination;
1Adopt three-jaw and ball air flotation for leveling at the same time, with high leveling accuracy for both large and small pieces;
2It has four functions: vacuum contact exposure, hard contact exposure, pressure contact exposure, and proximity exposure;
3Automatically separate the alignment gap and eliminate the exposure gap, with a gap separation of up to 500μm;
4Observe the alignment process simultaneously with a high-magnification binocular dual-field microscope and a 19-inch wide-screen LCD display,
And provide USB output; it not only meets the requirements of high-precision alignment but also can be used to detect the exposure results, and the exposure results and
It is convenient for storage;
5The motor mechanism, elastic element, and sensor ensure that the contact exposure pressure is appropriate and has good repeatability;
7、The exposure wavelength uses pure 365nm, with cold light illumination (the energy on the exposure surface is 15mW/cm, and the temperature is less than 30 degrees);
8、After alignment is completed, the exposure gap is automatically eliminated, there is no lateral drift, and it can be observed through the monitor;
9、The shutter can be opened individually, and it can also be set digitally for automatic countdown exposure (the setting range is 0.1s - 9999s);
10、It uses a 350W imported (German) DC mercury lamp, and the light energy density can be adjusted;
11、The mercury lamp has two modes: high brightness and “standby”, that is, high-brightness illumination is used during exposure, and when not exposing
low-brightness “standby” is used, thus extending the lifespan of the mercury lamp.
12、The equipment has an elegant and refined appearance and very reliable performance;
13、It is very convenient to load and unload wafers and plates. The automation level is very high and the operation is simple.
II. Technical Parameters
1、Exposure area: 100mm×100mm (upgradable to 6 inches)
2、Resolution: 0.8-1µm (positive photoresist with a thickness of 2mm)
3、Alignment accuracy::±0.8µm
4、Overall movement range of the mask sample: X: 6mm;Y:6mm
5、Mask size: 2.5 inches, 3 inches, 4 inches, 5 inches
6, Sample size diameterФ15mm--Ф100mm(Can adapt to non-standard slices or fragments)
7, Thickness 0.1mm--6mm (Can be extended to 15mm)
8, Lighting uniformity: ±3 - 4% (Ф100mmrange)
9, Movement stroke of the mask relative to the sample: X: ±5mm; Y: ±5mm; θ: ±6°
10、Mercury lamp power: 350W (DC)
11、Exposure wavelength: 365nm (Imported mercury lamp)
12、Exposure energy density: 15mW/cm can be increased or decreased as needed (Wavelength above 420nm is less than0.1mW/cm )
13、Exposure mode: Timing (Countdown mode 0.1s—9999.9s)
Application fields of lithography machine
Integrated circuit chips, electronic packaging, micro-electromechanical systems, micro-optical components, infrared detectors, bioelectrophoresis chips, laser diode lithography, grating lithography, waveguide array lithography, liquid crystal displays, surface acoustic wave devices, flat panel displays, large-size gratings,
Code disc engraving, etc.
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