2-layer Transparent FR-4 Material Ultra Long Ultra-thin PCB

Product Name: Transparent FR-4PCB

Board: FR-4, TG130 material

Number of floors: 2

Minimum line width/spacing: 12/12mil

Finished product size: 250x1200mm/1*1pcs

Surface technology: Sinking gold

Copper thickness: 35um

Plate thickness: 1.60mm

Minimum hole: 0.50mm

Features: Transparency meets 85-95% and can withstand normal temperatures of 220-240 degrees Celsius

Usage: Large size, LED transparent screen, display frequency, LED glass screen, etc

Detailed Introduction to Transparent FR-4 Multilayer PCB

Material characteristics

High transparency: Using special transparent FR-4 material, the transparency can reach 85% -92%, which can clearly
 display the internal circuit layout and component arrangement, bringing unique visual effects to productdesign.

Good electrical performance: Similar to ordinary FR-4 material, it has excellent electrical insulation performance, which
can effectively prevent current leakage and electromagnetic interference, ensuring stable operation of PCB in complex
electrical environments.

FR-4 transparent material ultra-thin PCB

FR-4 material soft board PCB

FR-4 material ultra long board PCB

2-layer transparent FR-4 material ultra long ultra-thin PCB

High mechanical strength: The glass fiber reinforced epoxy resin laminated board endows the transparent FR-4 multi-
layer PCB with good mechanical strength, enabling it to withstand certain external impacts and vibrations, and is not
 easily deformed or damaged, making it suitable for various application scenario
s.

Heat resistance: The heat resistance temperature range is usually between 130 ℃ and 180 ℃, which can maintain the
stability of its structure and performance in higher temperature environments and adapt to different working environ
ments.

Flame retardancy: As a flame-retardant material, FR-4 has flame-retardant properties and can self extinguish when bu
rned, improving the safety of PCB use and complying with relevant safety standards 2.

manufacturing process

High precision etching: Through high-precision exposure and etching processes, the transparent conductive layer is
precisely processed to ensure that the line width and spacing accuracy of the circuit pattern meet the design require
ments, usually up to 3/3mil or even smaller, ensuring the accuracy and consistency of the circuit.

Laminated process: Advanced laminating technology is one of the key steps in manufacturing transparent FR-4 multil
ayer PCBs, which requires ensuring tight bonding between layers to avoid problems such as bubbles and stress conc
entration. At the same time, it is required that the alignment error between layers be less than 10 μ m to ensure the
performance and reliability of the multilayer board.

Surface treatment: According to different application requirements, various surface treatment methods are provided,
such as OSP (organic solder mask), gold deposition, tin spraying, etc., which can improve the oxidation resistance, sol
derability, and wear resistance of the circuit board surface.

Application Area 1

Intelligent display: such as transparent display screens, smart glass, etc. The transparent FR-4 multi-layer PCB provides
a transparent circuit solution for display devices, making the display effect more unique and beautiful, while also achie
ving higher integration and functionality.

Automotive electronics: Used for intelligent instrument panels, head up displays, and other components in cars, which
can enhance the driving experience and bring more innovative space to car interior design, making the electronic devi
ces in the car more integrated with the overall interior style.

High end consumer electronics: In products such as smartphones, tablets, wearable devices, etc., transparent FR-4 mu
lti-layer PCB can provide more creativity for product design, showcase the technological and exquisite sense of the p
roduct, and meet consumers' needs for personalization and aesthetics.

Medical equipment: In the fields of medical imaging equipment, medical monitoring instruments, etc., transparent
PCBs can provide clearer image transmission and signal processing, which helps doctors to diagnose and treat more
 accurately, and also facilitates equipment maintenance and repair.

Process Capability Table
Technical ltem		MassProduct	Advanced Technology
		2015	2021	2025
Max.Layer Count		80 layer	100 layer	100 layer
PCB through hole board		2～80 layer	2～100 layer	2～100 layer
Maximum size through hole 1～2		37〞*98.50"	43.3〞*118.11"	43.3〞*118.11"
Minimum line width and spacing		10(0.40)	10(0.40)	7.50（0.30mm）
Minimum mechanical hole(mm)		12(0.50)	10(0.40)	8.50（0.35mm）
Maximum size through hole 4～22 layers		37〞*43.30"	43.3〞*43.30"	43.3〞*43.30"
Maximum size through hole 4～22 layers		31.50 ″*59"	31.50 ″*70.86"	31.50 ″*70.86"
Maximum size through hole 4～22 layers		10(0.40)	10(0.40)	7.50（0.30mm）
Minimum line width and spacing for multi-layer large-sized PCBs		10(0.40)	10(0.40)	7.50（0.30mm）
Maximum size of multi-layer through- hole : 4-22 layers with the smallest hole		12(0.50)	10(0.40)	8.50（0.35mm）
Maximum size HDI 4～36 layers		31.50 ″*55"	31.50 ″*55"	31.50 ″*55"
Minimum line width and line spacing of large size PCB		Through hole 12 / 12milHDI14 /14mil	Through hole 10/10 milHDI12 / 12mil	Through hole 8 / 8milHDI12 / 12mil
The largest board ruler 1 → the smallest hole of 18 layers		Through hole 0.50mmHDI :0.45mm	Through hole 0.50mm HDI : 0.45mm	Through hole 0.50mmHDI : 0.45mm
The layer number of FPC		1～36layer	1～60layer	1～60layer
Maximum size of flexible FPC		19.68〞*55"	28〞*59"	31.49〞*118.12"
Maximum size of flexible FPC with soft hard combination		19.68〞*55"	28〞*59"	31.49〞*118.12"
FPC (roll to roll) maximum size		19.68 ″*7874"	19.68 ″*7874"	19.68 ″*7874"
Maximum size of FPC single chip shipment		19.68 ″*118.11"	19.68 ″*196.8"	19.68 ″*196.80"
The layer number of FPC		2～18 layer	2～36 layer	2～42 layer
Maximum size of layered board		19.68 ″*35"	19.68 ″*43"	19.68 ″*43"
Number of through-hole layers		2～20layer	2～30 layer	2～40 layer
Hard and soft HDI layers		2～14 layer	2～18 layer	2～22 layer
Maximum size of soft and hard combination		19.68 ″*43"	19.68 ″*49"	19.68 ″*49"
FPC/soft-hard combination arbitrary interconnection HDI		4+X+4Interconnect HDI	5+X+5Interconnect HDI	6+X+6Interconnect HDI
HDIPCB layers		4～36layer	4～60layer	4～80 layer
Anylayer HDI PCB		4+X+4Interconnect HDI	5+X+5、Interconnect HDI	8+X+8、Interconnect HDI
HDIPCB maximum board size		24"*52"	43"*49"	43"*49"
Number of through hole layers of high frequency board		2～18 layer	2～36 layer	2～60 layer
HDI layers ofhighfrequency board		2～16 layer	2～24 layer	2～60layer
Maximum size of high frequency board		37 ″*43"	43 ″*49"	43 ″*49"
Number of ceramic plates		1-2 layer	1～4 layer	1～6 layer
Ceramic plate thickness		0.60mm-1.60mm	0.38mm-20.0mm	0.38mm-20.0mm
Maximum size of ceramic plate		100*150mm	150*190mm	150*650mm
Minimum aperture of ceramic plate		0.50mm	0.35mm	0.35mm
Minimum line width and line spacing of ceramic board		16/16mil	12/12mil	10/10mil
Number of layers of metal copper substrate		1-2 layer	1～4 layer	1～6 layer
Maximum line width and line spacing of metal iron substrate		12/12mil	4/4mil	4/4mil
Number of layers of metal aluminum substrateHDI		1-2 layer	1～4 layer	1～6 layer
Maximum size of metal substrate		37 ″*43"	25.59 ″*59"	25.59 ″*59"
The smallest hole of the metal substrate		0.50mm	0.35mm	0.35mm
Minimum line width and line spacing of metal substrate		8/8mil	4/4mil	4/4mil
Transparent FR-       4 material layers		1-2layer	1-2layer	1-8layer
Transparent FR-4 minimum hole		0.35mm	0.35mm	0.35mm
Transparent FR-4 minimum line width and spacing		4/4Mil	4/4Mil	3.5/3.5Mil
Transparent FR- 4 maximum size		23.63*47.25″	23.63*47.25 ″	23.63*47.25 ″
Number of tempered glass base layers		1-2layer	1-2layer	1-2layer
Minimum line width and spacing of glass		4/4Mil	4/4Mil	3.5/3.5Mil
The smallest hole in glass		0.35mm	0.35mm	0.35mm
Maximum size of glass		23.63*47.25″	23.63*47.25 ″	23.63*47.25 ″
Number of layers of transparent PETmaterial		1-2layer	1-2layer	1-2layer
Maximum size of transparent PET		19.68 ″*7874"	19.68 ″*7874"	19.68 ″*7874"
The company's main product types		Halogen free materials, high TG materials, high-frequency materials, high-speed materials, metal materials, glass materials, embedded materials, transparent FR- 4 materials, high thermal conductivity metals, high thermal conductivity aluminum substrates, environmentally friendly circuit boards, BT materials, ABF materials, and other imported materials, DU busbars, iron-based and metal based (core) mixed pressure plates, embedded buried copper, buried resistors, buried capacitors, buried ceramic bead plates, buried ceramics, ceramic mixed pressure plates, multi-layer ceramics, ultra-thin BT plates, ultra-thin PCBs, ultra-thin PCBs, multi-layer aluminum substrates, multi-layer ceramic plates, multi-layer ultra-thin HDI、  High frequency mixed voltage, differential impedance board, thick copper plate, gold-plated plate, high and low copper, high and low copper, high carbon resistance, transparent multilayer, glass plate, HDI arbitrary order (cross blind buried) Anylayer, flexible double-sided, flexible multilayer, soft hard combination HDI, roll to roll FPC, ultra long size, ultra large size board (single, double, multi-layer) PCB production and product design, product development, software development, etc
Main material		Rogers, Taikoni, Yaron, Mitsui, Isola, 3M, Taiyao, Taiguang, Tenghui, Shengyi,Lianmao, Nanya, Doosan, DuPont, Taihong, Hongren, Xinyang, Nippon Steel, Teflon,Yasen, Panasonic, RCC, Mitsui, Mitsubishi, Yingye, 3M, Kyocera, Jiuhao, Zhongci,Huaqing, Aishengda, Sliton, Kaichangde, Tongxin, Beige, Yalong, Taikoni,Hitachi, Laird System, etc
Main material categories		Halogen-free、halogenated、  high thermal conductivity, high TG135 、TG140、  TG150、  TG170、TG180、TG240、TG320
Build-up Material		FR-4 ，TG150,TG70,TG180
Conventional    plate  thickness     (mm)	Min.1-2L(mm)	0.10mm	0.10-12.0mm	0.10-18.0mm
	Min.4-10L(mm)	0.35mm	0.35mm～10.0mm	0.35-18.0mm
	Min.12L(mm)	0.43	0.38～10.0mm	0.38～18.0mm
	Min.16L(mm)	0.53	0.45～10.0mm	0.45～18.0mm
	Min.18L(mm)	0.63	0.51～10.0mm	0.51～18.0mm
	Min.52L(mm)	0.8	0.65～10.0mm	0.65～18.0mm
	MAX(mm)	3.5	12.0mm	18.0mm
Copper plate thickness and copper thickness	1-2 layerCU	700um	875um	875um
	Layers 4-20	4-12layer	4-16layer	4-22layer
	Inner layer copper thickness（um)	875um	1050um	1225um
	Outercopperthickness	210um	350um	525um
	Thick copper finished plate thickness	8.0mm	12.0mm	18.0mm
IC substrate	layerHDI	1-10layer	1-14layer	1-16layer
	Line width and spacing	50um	25um	15um
	copper thickness	8-10um	10-12um	12-15um
Min.CoreThickness um(mil)		254" (10.0)	0.15～254(10.0mm)	0.15～254(10.0mm)
Min.Build up Dielectric		38(1.5)	25(1.0)	25(1.0)
BaseCopperWeigh t	Inner Layer	1/4-8 OZ	1/4-0.30mm	1/4-0.30mm
	Out Layer	1/4-10 OZ	1/4-30 OZ	1/4-30 OZ
Gold thick		1～40u"	1～200u"	1～200u"
Nithick		76～127u"	1～250u"	1～250u"
Min.HOle/Land um(mil)		150/300(6/12)	100/200(4/8)	100/200(4/8)
Min.Laser via/landum(mil)		60/170(2.4/6.8)	50/150(2/6)	50/150(2/6)
Min. IVH、Hole size/landum(mil)		150/300(6/12)	100/200(4/8)	100/200(4/8)
DieletricThickness		38(1.5)	32(1.3)	32(1.3)
		125(5)	125(5)	125(5)
SKipvia		Yes	Yes	Yes
viaoNhie(laserviaon BuriedPTH)		Yes	Yes	Yes
Laser Hole Filling		Yes	Yes	Yes
Technicalltem		MassProduct	Advanced Technology
Hole depth/diameter	Through Hoie	25:01 :00	35:01 :00	40:01 :00
AspctRatio	MicroVia	0.8 :1	0.8 :1	0.8 :1
copperFilling Dimple Size		10(0.40)	5(0.20)	5(0.20)
Minimumouter line width/ spacing	Inner layer line width and spacing	38/38(1.5/1.5)	38/38(1.5/1.5)	38/38(1.5/1.5)
	PlatedLayerum(mil)	38/38(1.5/1.5)	38/38(1.5/1.5)	38/38(1.5/1.5)
BGAPitchmm(mil)		0.4	0.4	0.4
PHMin.Hole rlng um(mil)		75(3)	62.50(2.50	62.50(2.50
Line Width control	<2.5mil(mil)	±0.50	±0.50	±0.50
	2.5mil≤L/W<4mil	±0.50	±0.50	±0.50
	≤3mil(mil)	±0.60	±0.60	±0.60
SolderMask Registration um(mil)		±25	±25	±25
Solder masThickness	Lines Minum(mil)	10(0.40)	10(0.40)	10(0.40)
	Lines Minum(mil)	30(1.20)	30(1.20)	30(1.20)
	CopperMinum(mil)	10(0.40)	10(0.40)	10(0.40)
	CopperMax um(mil)	30(1.20)	30(1.20)	30(1.20)
Mln.Solder Mask opening um(mil)		250(10)	200(8)	200(8)
Structure	Stacking layer by layer	5+N+5	6+N+6	7+N+7
	Sequenetlal Bu il-up	42Any Layer	46Any Layer	60Any Layer
	Stacking layer by layer	N+N	N+N	N+N
		N+X+N	N+X+N	N+X+N
	Sequenetlal Lamination	4+(N+X+N)+4	5+(N+X+N)+5	6+(N+X+N)+6
Multi-layer stepped structure	Multi- layer stacking	5+N+5	6+N+6	7+N+7
	Sequenetlal Bu il-up	12Any Layer	16Any Layer	18Any Layer
	Multi- layer staircase	4 steps	6 steps	6 steps
Mechanical depth control drilling depth		2.0mm±0.08mm	2.0mm±0.08m	2.0mm±0.08m
Laser controlled depth drilling		0.6mm±0.08mm	0.8mm±0.08mm	1.0mm±0.08mm
/Min.HOle/Land um(mil)	linner um(mil)	150/300(6/12)	100/200(4/8)	100/200(4/8)
	Outer um(mil)	150/300(6/12)	100/200(4/8)	100/200(4/8)
Minimumburiedholediameter/solder pad		60/170(2.4/6.8)	50/150(2/6)	50/150(2/6)
SUBDielectricThic      kness	Mln.um(mil)	38(1.5)	32(1.3)	25(1.0)
	Max.um(mil)	125(5)	125(5)	125(5)
SKipvia		Yes	Yes	Yes
Via on hole(LaserViaon BuriePTH		Yes	Yes	Yes
Laser Hole Filling		Yes	Yes	Yes
Resin plug hole plate thickness	Min mm(mil)	0.35	0.35	0.35
	Max mm(mil)	3.2	3.2	3.2
Min mm(mil)		125(5)	110(4.50)	110(4.50)
Routing Depth control Accuracy um(mil)		±50um(mil)	±50um(mil)	±50um(mil)
Outine NC Rcuting Tolerance um(mil)		75(3)	75(3)	75(3)
Type of surface Finishing		OSP、  Sinking gold, lead-free tin, lead tin, electroplated gold fingers, electroplated gold (electroplated nickel hard gold, electroplated nickel soft gold), gold fingers+sinking gold, spray tin+gold fingers, OSP+electroplated gold, OSP+sinking gold, electroplated silver, electroplated silver, electroplated tin, gold coated silver, nickel free electroplated thick gold, nickel free electroplated thick silver, tin silver copper, OSP+gold fingers
EN Thickness Control(um)		>0.025-0.1um	>0.025-0.1um	>0.025-0.1um
OSOSP Thickness(um)		>0.20-0.50um	>0.20-0.50um	>0.20-0.50um
Ni Thickness(um)		>105⇢ 250um	>105⇢ 250um	>105⇢ 250um
Platinum thickness control		>0.025-5um	>0.025-5um	>0.025-5um
Lead/lead- free tin spraying thickness		>105⇢ 150um	>105⇢ 150um	>105⇢ 150um
Electrosilver		>105⇢ 140um	>105⇢ 140um	>105⇢ 140um
Thickness control of sinking silver		>105⇢ 140um	>105⇢ 140um	>105⇢ 140um
Tin thickness control		>105⇢ 140um	>105⇢ 140um	>105⇢ 140um
Min TestPAD	E/Tum(mil)	75(3)	75(3)	75(3)
	E/Tum(mil)	50(2)	50(2)	50(2)
	E/Tum(mil	25(1)	25(1)	25(1)
	E/Tum(mil)	150（6）	150（6）	150（6）
lmpedanceContro lTolerance	≧50ohm	± 10%	±8%	±8%
	≦50ohm	±50ohm	±50ohm	±50ohm
Finished board	Plate thickness≧0.15mm	≧ ± 10%	≧ ± 10%	≧ ± 10%
	Plate thickness≧0.15mm	≧ ±0.075%	≧ ±0.075%	≧ ±0.075%
Warpage		≤0.7%	≤0.5%	≤0.5%
The above are the conventional production skills of Chaosheng Group Company, and there are any unclear points. Please further communicate with our specialized technical personnel, and we will be happy to serve you! Welcome to our guide!