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Home > Electrical & Electronics > Electrical Control System > NI SCXI-1193 32-Channel RF Multiplexer Switch Module

NI SCXI-1193 32-Channel RF Multiplexer Switch Module

NI SCXI-1193 32-Channel RF Multiplexer Switch Module thumbnail-3

NI SCXI-1193 32-Channel RF Multiplexer Switch Module photo-1

NI SCXI-1193 32-Channel RF Multiplexer Switch Module photo-2

NI SCXI-1193 32-Channel RF Multiplexer Switch Module photo-3

Negotiable MOQ: 1 Piece (Price negotiable depending on order volume and customization)

Key Specifications

Get Latest Price

Material:

Other, Global universal model

Condition:

Other, Global universal model

Task:

Other, Global universal model

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Guizhou Yuanmiao Automation Equipment Co., Ltd.

1Yr

Payment & Shipping

Payment Methods:

Port of Shipment:

China

Delivery Detail:

Delivery time depends on order quantity.

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Material Other, Global universal model

Condition Other, Global universal model

Task Other, Global universal model

Mathematical Model Other, Global universal model

Signal Other, Global universal model

Customized Non-Customized

Structure Other, Global universal model

Power Requirements +5V DC (50mA)

Dimensions 1.2×6.8×7.8 inches

Storage temperature -20°C to 70°C

NI SCXI-1193

Functional Features:

Flexible Multiplexing & Topologies: Programmable as unterminated multiplexers, externally terminated multiplexers, or size-flexible sparse matrices. Supports various topologies (e.g., four 8x1 multiplexers, four 4x1 terminated multiplexers) to meet diverse signal switching and Reuse requirements.
Excellent High-Frequency Performance: Operates from DC to over 500MHz with typical bandwidth >900MHz. Ideal for RF signal measurement and analysis, featuring low insertion loss, high isolation, and high stability to ensure signal integrity.
Modular & Compatible Design: Integrates seamlessly with other SCXI modules via the SCXI bus interface. Compatible with NI's hardware/software solutions (e.g., PXI-5404 frequency generator, PXI-5112 high-speed digitizer) for flexible test system configurations.

Hardware Specifications:

Interface: 36 MCX jacks for I/O connectors, 2 SMB jacks for trigger connectors. Uses high-density push-on MCX connectors for discrete, manageable cabling.
Relay Characteristics: Silver-palladium and gold-plated electromechanical latching relays. Scanning rate: 100 operations per second.
Power Requirements: +5V DC (50mA), +18.5V to +25V DC (170mA), -18.5V to -25V DC (170mA).
Physical Dimensions: 1.2×6.8×7.8 inches, 2 oz weight. Operating temperature: 0°C to 50°C. Storage temperature: -20°C to 70°C. Humidity: 5% to 85% non-condensing.

Applications:
Commonly used in communications, radar, and RF testing. Enables switching between multiple RF signal sources and acquisition devices in data collection systems, improving equipment utilization. In test systems, it supports RF device parameter measurements (e.g., automatic shortwave radio testing via RF channel switching).

Common Faults & Solutions for NI SCXI-1193I. Module Not Recognized or Communication Issues

Symptoms:

Module not detected in Measurement & Automation Explorer (MAX).
Status indicators (power/communication lights) off or flashing abnormally.

Possible Causes & Solutions:

Power Connection Issues

Cause: Inadequate power supply or loose cables.
Solution:

Verify stable power output (±5V, ±15V) with a multimeter.
Re-seat module and backplane connectors.

Communication Bus Failure

Cause: Damaged backplane bus or loose slot connections.
Solution:

Test module in alternate slots to isolate slot issues.
Contact NI support if multiple modules fail (possible backplane replacement).

Driver Issues

Cause: Outdated or corrupted NI-DAQmx drivers.
Solution:

Reinstall latest NI-DAQmx drivers (v19.0+).
Rescan hardware in MAX and manually configure the module.

II. Abnormal Signal Acquisition (No Output/Distortion)

Symptoms:

Zero or erratic data after signal input.
Output amplitude/frequency mismatch with obviously distortion.

Possible Causes & Solutions:

Incorrect Input Connections

Cause: Reversed, shorted, or loose cables (e.g., differential inputs miswired).
Solution:

Refer to the manual to confirm terminal definitions (IN+, IN-, GND).
Test cable continuity with a multimeter and replace damaged cables.

Gain/Filter Configuration Errors

Cause: Mismatched gain settings or improper filter cutoff frequencies.
Solution:

Adjust gain (1, 10, 100, 1000x) to keep signals within DAQ input range (e.g., ±10V).
Set filter cutoff frequency (10Hz–10kHz) to avoid noise or signal attenuation (e.g., 1kHz+ for vibration signals).

Isolation Failure

Cause: Isolation layer damage from prolonged overvoltage operation.
Solution:

Check for input voltage exceeding ±30V; replace module if damaged.
Add external overvoltage protection (e.g., TVS diodes).

III. Excessive Measurement Deviation

Symptoms:

Deviation exceeds accuracy specs (±0.05% of reading + 2μV).
- Obviously zero drift or inconsistent results.

Possible Causes & Solutions:

Uncalibrated or Failed Calibration

Cause: Calibration not performed or EEPROM calibration data lost.
Solution:

Run "Self-Calibration" in MAX to regenerate calibration constants.
Return for repair if calibration fails.

Environmental Interference

Cause: Electromagnetic interference (EMI) or temperature outside -40°C~+85°C.
Solution:

Relocate modules away from EMI sources (e.g., inverters, transformers). Use shielded cables grounded at one end.
Ensure ambient temperature compliance; add cooling for high-temperature environments.

Unsuppressed Common-Mode Interference

Cause: Common-mode voltage exceeding module CMRR (>110dB).
Solution:

Verify common-mode voltage ≤±10V; add common-mode rejection circuitry if needed.
Ensure sensor and module share a common ground to minimize potential differences.

IV. Overheating or Abnormal Heat

Symptoms:

Module surface temperature exceeds normal operating limits (≤50°C, not Hot to the touch).

Possible Causes & Solutions:

Poor Heat Dissipation

Cause: Blocked ventilation or enclosed installation.
Solution:

Clean chassis vents; add fans for enclosed environments.
Avoid mounting near high-heat components (e.g., power supplies).

Internal Circuit Short

Cause: Overvoltage damage or component aging.
Solution:

Immediately power off; check for overvoltage and replace damaged protection components (e.g., TVS diodes).
Contact NI support for motherboard inspection if shorting persists.

V. Cross-Talk or Excessive Noise Between Channels

Symptoms:

Data fluctuations in adjacent channels during signal input.

Possible Causes & Solutions:

Degraded Isolation Performance

Cause: Channel-to-channel isolation (2500V rms) compromised by aging or overvoltage.
Solution:

Avoid voltage differentials exceeding isolation ratings; replace module if cross-talk occurs.
Add isolation resistors (e.g., 1kΩ) at signal inputs to reduce coupling.

Poor Grounding Design

Cause: Mixed grounding methods introducing ground loops.
Solution:

Implement single-point grounding for all channels to eliminate loops.
Ground cable shields at the module end to reduce EMI.

VI. Quick Troubleshooting Steps

Hardware Self-Check:

Verify indicator status (power light steady, communication light flashing).
Run "Self-Test" in MAX for diagnostic reports.

Signal Verification:

Input a known reference signal (e.g., ±1V DC) and compare results.
Use an oscilloscope to monitor output for distortion or noise.

Software Debugging:

Reset module configurations and test with NI example programs (e.g., LabVIEW DAQ Assistant).
Update drivers to the latest version to resolve compatibility issues.

Product Tags: SCXI-1193 , SCXI-1162HV , SCXI-1104C