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Help CenterGrey 2.8W/mK Thermal Conductive Gap Filler Pad for RDRAM Memory Modules
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Grey 2.8W/mK thermal conductive gap filler pad for RDRAM memory modules
The TIF™340 Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
Features
》Good thermal conductive: 2.8 W/mK
》Naturally tacky needing no further adhesive coating
》Soft and Compressible for low stress applications
》Available in varies thickness
Applications
》Cooling components to the chassis of frame
》High speed mass storage drives
》Heat Sinking Housing at LED-lit BLU in LCD
》LED TV and LED-lit lamps
》RDRAM memory modules
》Micro heat pipe thermal solutions
》Automotive engine control units
》Telecommunication hardware
》Handheld portable electronics
》Semiconductor automated test equipment (ATE)
| Typical Properties of TIF™340 Series | ||
| Color | Gray | Visual |
| Construction & | Ceramic filled silicone rubber | *** |
| Compostion | ||
| Specific Gravity | 2.50 g/cc | ASTM D297 |
| Heat Capacity | 1 l/g-K | ASTM C351 |
| Hardness | 27 Shore 00 | ASTM 2240 |
| Tensile Strength | 35 psi | ASTM D412 |
| Continuos Use Temp | -50 to 200℃ | *** |
| Outgassing(TML) | 0.45% | ASTM E595 |
| Dielectric Constant | 10.2 MHz | ASTM D150 |
| Volume Resistivity | 7.3X10" | ASTM D257 |
| Ohm-meter | ||
| Fire rating | 94 V0 | equivalent UL |
| Thermal conductivity | 2.8 W/m-K | ASTM D5470 |
Standard Thicknesses:
0.040" (1.02mm)
Consult the factory alternate thickness.
Standard Sheets Sizes:
8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.
Contact us：Mor information, please contact us: sales22@ziitek.com
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