BERGQUIST SP900S SIL PAD 900S AC SIL PAD TSP 1600S

Features and Benefits:


• Thermal impedance: ：0.61°C-in2/W(@50 psi)

• Electrically isolating

• Low mounting pressures

• Smooth and highly compliant surface

• General-purpose thermal interface material solution

The true workhorse of the SIL PAD  product family, SIL PAD900S AC (BERGQUIST SP900S AC)thermally  conductive insulation material 

is designed for a wide variety of applications  requiring high thermal performance and electrical isolation. 

These applications  also typically have low mounting  pressures for component™clamping.

BERGQUIST SIL PAD 900S AC (SIL PAD TSP 1600S AC)material combines a smooth and highly compliant surface  characteristic with 

high thermalconductivity. These features optimize the thermal resistance properties at  low pressures.

Applications requiring low component  clamping forces include discrete semiconductors (TO-220, TO-247

 and TO-218) mounted with spring clips. Spring clips assist with quick assembly and apply a limited amount 

of force to the semiconductor. The smooth surface texture of SIL PAD 900S minimizes interfacial thermal

 resistance and  maximizes thermal performance.

BERGQUIST SP900S AC Typical Applications Include:

• Power supplies

• Automotive electronics

• Motor controls

• Power semiconductors

Configurations Available:

• Sheet form, die-cut parts and roll form

• With or without pressure sensitive adhesive