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Help CenterBERGQUIST SP900S SIL PAD 900S AC SIL PAD TSP 1600S
Related Products
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BERGQUIST SP400 SIL PAD 400 SIL PAD TSP 900US$ 1 - 2MOQ: 1 Roll -
BERGQUIST SP900S SIL PAD 900S SIL PAD TSP 1600SUS$ 1 - 2MOQ: 1 Roll
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BERGQUIST SPK10 SIL PAD K-10 SIL PAD TSP K1300US$ 1 - 2MOQ: 1 Roll
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BERGQUIST SP2000 SIL PAD TSP 3500 SIL PAD 2000US$ 1 - 2MOQ: 5 Sheets
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BERGQUIST SPA1500 SIL PAD A1500 SIL PAD TSP A2000US$ 1 - 2MOQ: 10 Pieces
Features and Benefits:
• Thermal impedance: ：0.61°C-in2/W(@50 psi)
• Electrically isolating
• Low mounting pressures
• Smooth and highly compliant surface
• General-purpose thermal interface material solution
The true workhorse of the SIL PAD product family, SIL PAD900S AC (BERGQUIST SP900S AC)thermally conductive insulation material
is designed for a wide variety of applications requiring high thermal performance and electrical isolation.
These applications also typically have low mounting pressures for componentclamping.
BERGQUIST SIL PAD 900S AC (SIL PAD TSP 1600S AC)material combines a smooth and highly compliant surface characteristic with
high thermalconductivity. These features optimize the thermal resistance properties at low pressures.
Applications requiring low component clamping forces include discrete semiconductors (TO-220, TO-247
and TO-218) mounted with spring clips. Spring clips assist with quick assembly and apply a limited amount
of force to the semiconductor. The smooth surface texture of SIL PAD 900S minimizes interfacial thermal
resistance and maximizes thermal performance.
BERGQUIST SP900S AC Typical Applications Include:
• Power supplies
• Automotive electronics
• Motor controls
• Power semiconductors
Configurations Available:
• Sheet form, die-cut parts and roll form
• With or without pressure sensitive adhesive
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