Excellent Quality 2.5 W/mK Memory Modules Thermal Conductive Phase Change Materials
The TIC™810A Series is low melting point thermal interface material. At 50℃, The TIC™810A Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™810A Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.
The TIC™810A Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.
Features
Thermal conductivity: 2.5 W/mK
0.020℃-in² /W thermal resistance
Naturally tacky at room temperature, no adhesive required
No heat sink preheating required
Applications
High Frequency Microprocessors
Notebook and Desktop PCs
Computer Serves
Memory Modules
Cache Chips
IGBTs
TM D5470 (modified)
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