SiC Wafer without polishing Supplier

SiC Wafer without polishing Supplier

We provide 4-8 inch SiC wafer but without lappling and polishing. If you want to test SiC processing equipment, we recommend you puchase un-process SIC wafer in HMT. You can get the favourable price of As-cut SiC Wafer. The leadtime of SiC wafer will be 4 weeks after you place order to us. 

The silicon carbide substrate produced by the company is a compound semiconductor single crystal material composed of carbon and silicon. It has the characteristics of large band gap, high thermal conductivity, high critical breakdown field strength, and high electron saturation drift rate, which can effectively break through the physical limits of traditional silicon-based semiconductor devices and materials. It has developed a new generation of semiconductor devices that are more adaptable to high pressure, high temperature, high power, high frequency and other conditions, and has the potential to be widely used in "new infrastructure" fields such as 5G base station construction, UHV, intercity high-speed railway and urban rail transit, new energy vehicles and charging piles, and big data centers.