SAMSUNG (Samsung Semiconductor) KLM8G1GETF-B041 Package FBGA
KLM8G1GETF-B041 Product Comprehensive Information
1. Product Overview
Model: KLM8G1GETF-B041, Samsung eMMC series embedded memory chip, in BGA-153 package 15.
Capacity: 8GB, based on 64Gb (8GB) NAND flash memory design37.
Core features: Supports dual voltage (1.8V/3.3V), low-power design, suitable for high-density and small-volume mobile devices23.
2. Technical parameters
Interface protocol: Comply with eMMC standard, supports MMC interface clock frequency 0-200MHz, and start frequency 0-52MHz5.
Voltage Range: Dual voltage compatible with 36.
Operating Temperature:
Industrial grade: -25°C to +85°C (operating temperature), -40°C to +85°C (storage temperature)57.
Some channels are marked as -40°C to +85°C (operating temperature)3.
Package size: BGA-153 package, the specific size varies according to different sources15.
3. Application scenarios
Mobile devices: thin and light terminals such as smartphones, tablets27.
Industrial and Consumer Electronics: Industrial Control, Automotive Electronics, 3C Digital Products, etc.13.
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