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Home > Products > Silicon Carbide Wafer > 2 inch as cut SiC Wafer manufacturer with good price for diamond grinding TTV＜1um SiC Substrate Wafer
2 inch as cut SiC Wafer manufacturer with good price for diamond grinding TTV＜1um SiC Substrate Wafer
- 10000 Piece / Pieces per Month
- SHANGHAI
- T/T
- 30 days
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Product Details
| Brand Name | HMT | Place of Origin | China | |
| Model Number | 2 inch |
Product Description
2 inch as cut SiC Wafer manufacturer with good price for diamond grinding TTV＜1um SiC Substrate Wafer
As the professional As cut SiC Wafer Manufacturer and supplier, HMT supply high quality 2 inch As cut SiC wafer no polishing. we support customized Raw cut SiC wafer thickness and parameters like TTV <1um. Normally we have 1200um 1100um 900um etc thickness for diamond grinding, abrasives, newest polishing technology applications.
SiC wide energy Gap (Band Gap) than the existing Si (silicon) Gap width more than 3 times wider, can withstand more than 10 times the voltage, SiC low loss, high power characteristics suitable for high voltage and high current application field, including electric vehicles, electric vehicle charging infrastructure, solar energy and offshore wind power and other green power generation equipment.ompared with traditional Si, the third-generation semiconductor material SiC can reduce the power conversion loss by 50%, reduce the power conversion cost by 20%, and improve the endurance of electric vehicles by 4%.
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- Homray Material Technology
- Contact nameTina Chang Chat Now
- Phone86-512-67078567
- Address60 Suli Road, Suzhou, Jiangsu
Product Categories
| Silicon Wafer | Silicon Carbide Wafer | Gallium Nitride |
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