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Help Center2 Inch as Cut SiC Wafer Manufacturer With Good Price for Diamond Grinding TTV＜1um SiC Substrate Wafer
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2 inch as cut SiC Wafer manufacturer with good price for diamond grinding TTV＜1um SiC Substrate Wafer
As the professional As cut SiC Wafer Manufacturer and supplier, HMT supply high quality 2 inch As cut SiC wafer no polishing. we support customized Raw cut SiC wafer thickness and parameters like TTV
SiC wide energy Gap (Band Gap) than the existing Si (silicon) Gap width more than 3 times wider, can withstand more than 10 times the voltage, SiC low loss, high power characteristics suitable for high voltage and high current application field, including electric vehicles, electric vehicle charging infrastructure, solar energy and offshore wind power and other green power generation equipment.ompared with traditional Si, the third-generation semiconductor material SiC can reduce the power conversion loss by 50%, reduce the power conversion cost by 20%, and improve the endurance of electric vehicles by 4%.
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