BGA Reballing Automatic For Mobile Phone Small BGA Chip Repairing Machine

Specifications

BGA Reballing Automatic For Mobile Phone Small BGA Chip Repairing Machine

Specification:

Main feature:

1.Embedded Industrial PC, high definition touch screen interface, PLC control, and instant profile analysis function. Real-time settings and actual temperature profile display can be used to analyzed and correct parameters if necessary.

2.It uses precise K-type close circuit control and automatic temperature adjustment system, with PLC and temperature module to enable precision temperature control of ±2 degC. External temperature sensor enables temperature monitoring and accurate analysis of real time temperature profile.

3.V-groove PCB support for rapid, convenience and accurate positioning that fits for all kinds of PCB board.

4.Flexible and convenient removable fixture on the PCB board which protectsand prevent damage to PCB. It can also adapt to rework various BGA packages.

5.Various sizes of BGA nozzles, which can be adjusted 360 degree for easy installation and replacement;

6.Three temperature areas can independently heat and are multiple controllable and adjustable to ensure best integration of different temperature areas. Heating temperature, time, angle, cooling and vacuuming can all be set on the interface.

7.There are 6-8 levels of variable and constant temperature controls. Massive storage of temperature curves which are Instant accessible according to different BGA. Curve analysis, setting and adjustment are all accessible via touch screen. Three heating areas adopts independent PID calculation to control heating process to enable more accurate and precise temperature control.

8.It uses high powered blower to enable fast cooling of PCB board and prevent it from deformation. There are also internal vacuum pump and external vacuum pen to assist with fetching the BGA chip.

9.Including Voice "early warning" function. 5-10 seconds before the completion of uninstalling or welding, voice reminder / warning to get the workers prepared. Cooling system will start after vertical wind stopped heating. When the temperature drops to room temperature, the cooling process will stop, so that the machine will not age after heated up.

10.CE certification, with emergency switch and automatic power-off protection device when emergency happens.

Product show:

Accessories:

Packing:

Factory:

CE and ISO9001 certificate:

Why choose us?

1, Well-equipped manufacturing facility. 

2,Professionalism innovative R&D team, provide professional service for bga rework station solution.

3,Optimum performance,precision temperature control to ensure high rate of success for S&M. As we know,  the performance of bga chip soldering and desoldering highly depends on the precise of the temperature. Our bga machine use PID control,the data acquisition frequency of our machine is 10ms(which means every 10ms the PID will grab the data to correcting the temperature), but among the bga rework station industry, most of company just use the PID grab freqency is 30ms.

4,International quality standard range,all our product have got the CE,  ISO9001,ROHS approval.

6,Customized packaging and Fast delivery via Fedex, DHL, UPS, EMS, TNT and so on. Generally goods can be ready in 7 days after the receipt of the payment.

7,We supply 1 year warranty for this BGA rework station , in the first year, offer spare parts for free,  and the heating colil is for three year warranty. Life long technical support.

Shipping:

DHL, FedEx, By air, By sea

The shipping cost depends on the total weight

Normally, it takes about 3 days to USA, 5 days to European countries. We can ship as your request and help you find the most cost efficient and fast way.

We will send you the tracking number as soon as delivery

Payment:

T/T, Western Union, PayPal