Contact Platform Support
Help CenterBGA Rework Station With 3 Independent Heating Zone
Related Products
-
Semi-auto Bga Rework System for Laptop Bga RepairUS$ 16,000 - 20,000MOQ: 1 Set -
Soldering and Desoldering 2 in 1 Bga Rework StationUS$ 5,000 - 8,000MOQ: 1 Set
-
Semi-auto BGA Chips Repairing Machine BGA Reballing Machine DH-A2NegotiableMOQ: 1 Set
-
Manual Optical Alignment BGA Rework Station DH-G200 With CCD CameraNegotiableMOQ: 1 Set
-
DH- A4 DingHua Bga Rework FactoryUS$ 16,000 - 20,000MOQ: 1 Piece
Specifications
BGA rework station with 3 independent heating zoneOptical alignment
CCD camera system
Laser positioning
BGA rework station with 3 independent heating zone
Function of ccd camera bga rework station
NO. |
Name |
Use |
Usage |
1 |
Counterpoint head limit rod |
Limit the counterpoint head location |
Rotate to appropriate location |
2 |
displayer |
Display BGA image |
Insert video joint and power source wire |
3 |
Counterpoint head organization |
draw,lay BGA organization |
|
4 |
Counterpoint head removable handle |
Adjust the location of Counterpoint head |
Rotate the handle |
5 |
Angle adjust knob |
fine adjustment of BGA angle |
Rotate micrometer |
6 |
BGA straw |
Catch up BGA |
|
7 |
Laser registration organ |
Make the image to display |
drag out by hand |
8 |
Upper heating nozzle |
Make the hot air more Concentrated even |
Make air outlet has a appropriate distance from BGA |
9 |
Lower heating nozzle |
Make the hot air more Concentrated even |
Make air outlet has a appropriate distance from BGA |
10 |
Cross flow fan |
Cooling the PCB board after welding |
|
11 |
X axis adjustment of PCB board |
Adjust X axis of PCB board |
rotate micrometer |
12 |
Y axis adjustment of PCB board |
Adjust Y axis of PCB board |
Rotate micrometer |
13 |
Large button |
Enlarge the image |
Press the button |
14 |
Lessen button |
Lessen the image |
Press the button |
15 |
Scram button |
To stop immediately |
Press the button |
16 |
Switch of laser registration |
Turn on or down the laser |
Press the button |
17 |
Starting switch |
Heat automatically |
Press the button |
18 |
LED button |
LED switch |
Press the button |
19 |
Upper heating limit rod |
Limit the upper heating location |
rotate |
20 |
Upper heating organization |
Heat automatically for upper heating organization |
Control by hand or automatically |
21 |
Removable handle |
Move upper heating and counterpoint organization |
Hold by hand |
22 |
removable handle of upper heating |
Adjust the position up and down |
Rotate the handle |
23 |
limit pad around |
Fixed position |
|
24 |
Laser registration |
Indicate the BGA position |
Press down the laser registration button |
25 |
LED |
light during the working hours |
Press down the LED button |
26 |
Powder adjustment |
Adjust the PCB powder |
screw after unscrew adjustment |
27 |
Infrared temperature zone |
For pre-heating |
|
28 |
Temperature measurement connector |
measure the actual temperature |
Connect the Temperature measuring line directly |
29 |
Brightness adjustment |
Adjust the brightness |
Rotate around |
30 |
Touch screen |
Handle the machine to store the data |
|
Parameters of irda welder bga rework station
Power supply |
AC220V±10% 50/60Hz |
Power |
6500W |
Top heater |
Hot air 1200W |
Bottom heater |
Hot air 1200W, Infrared 3900W |
Positioning |
V-groove, PCB support can be adjusted in any direction and with external universal fixture |
Temperature control |
K type thermocouple, closed loop control, independent heating |
Temp accuracy |
±2℃ |
PCB size |
Max 500*400 mm Min 22*22 mm |
Workbench fine-tuning |
±15mm forward/backward, ±15mm right/left |
Camera magnification |
10x-100x |
BGA chip |
2*2-80*80mm |
Minimum chip spacing |
0.15mm |
External Temperature Sensor |
1-5(optional) |
Placement Accuracy |
±0.01MM |
Machine dimension |
(L*W*H): 67*77*75cm |
Packing dimension |
(L*W*H): 80*84*80cm |
NW/GW |
approx 80/112 KG |
Features of optiacal alignment bga rework station
1. High definition touch screen, human-machine interface operation, PLC control, with instant profile analysis function. Real-time display settings and actual temperature curve, which can also be used to analyze and correct the curve if necessary
2. This machine uses high precise K-type thermocouple closed-loop control and automatic temperature compensation system. It combines with PLC and temperature module, which enable precise temperature deviation to add and subtract 2 degrees. Meanwhile ,external temperature measurement connector enables temperature diction and accurate analysis of real time temperature curve.
3.This machine has high-precision digital view system, and the PCB board uses V-groove for rapid, convenient and accurate positioning, linear slide for fine adjustment of X,Y,Z axis, so that it can fit for all kinds of PCB board.
4. Flexible and convenient universal clipon the PCB board can protect the PCB fringe devices from damaging and deformation. It can also adapt to various BGA’s reworking.
5.Various sizes of BGA alloy (nozzles) nozzles, which can be adjusted 360 degree for easily installation and replacement.
6. There are three independent temperature zones, which can help to conduct multi-group and multi-stage temperature control, and guarantee different temperature zones have the best welding result. Heating temperature,time,speed,cooling and vacuum can all be set on the screen.
7. It can set 6 temperature control in the temperature zones up and down, which can expand to 8 grades and store huge temperature curves. Curve analysis, setting and correctness can all be done on the touch screen. These three heating zones use independent PID arithmetic to control the heating process.
8. More even temperature rise and more accurate temperature.
9.It adopts high flow fan for cooling the PCB board rapid. Besides, it can prevent the PCB board from deformation. The surface mount,weld and dismantle process realize automatic control.
10.Collocating with sound control "early warning" function. It can warn workers to make some relative preparation 5-10 seconds before the completion of uninstalling or welding.
11.After heating, the cooling system will start. It will stop cooling automatically after the temperature becomes room temperature, which can assure this machine will not be aged!
12.It wins CE certification, and this appliance was equipped with emergency stop switch and automatic power-off protection device when emergency happens.
1. The machine can be delivered by DHL, FedEx, TNT, EMS, UPS.
2. By sea or by air. Please provide us your nearest port.
3. The delivery date is within 7 days after the receipt of payment. If you are in urgent need of it,please kindly tell us.
Company profile
Shenzhen Dinghua Technology & Development Co., Ltd is a professional manufacturer of BGA rework station, rework tools and associated equipments, engaging in design, production, sales and service.We commit us to make the professional equipment, provide the high quality a perfect service for the customer. As one of pioneer in this industry, we continue to improve and innovate along with the market demands by absorbing the advanced development experience from home and abroad to adhering to our vision of ‘Professionalism, Honesty, Innovative and Responsibility’.
Science and technology are primary productive forces. Through teamwork, we achieved the core thermal-control technology with related patent. At the same time, our products cover 3 categories: high-end, mid-end and low-end for development and production using manual, semi-auto to fully automated processes. Our market had expanded into industries like: individual repair, factories, education, military and aerospace etc. And we had established the point-of sales and end service at locally and abroad.
Your satisfaction is our target, adhering to customer-focus, market oriented, and our company provides fist class products and high efficient services for customers through continuous innovation. We are honored to work with you to create a brighter future.
Our compay production bga rework station
Our customer to buy our bga rework station
1.All the machine will be well tested for 3 days before sending.
2.The whole machine is for 1-year warranty, the heating wire is for 3-years warranty
Bga rework station chip bond FAQ;
1. Missing solder
It will cause the off-normal with the manual counterpoint, and there will be a process of automatic correction between welding plate and the bga chip under the effect of the surface tension of the solder ball.
Chip uneven decline result from the uneven heating, or the early returning result in the run-off. If stop the reflow at this time, it will cause the missing solder. So we need to extend the time of soldering temperature. Or we also can increase the soldering temperature to make the degradation of the solder ball uniformity.
2. Short circuit.
When the solder ball arrive in the melting point and is at the status of liquid, the higher time,temperature and pressure will damage the surface tension and supporting role of the solder ball. And then resulting the short circuit. So we need to cut down the time of soldering appropriately, or we can lower the soldering temperature.
3. A chip burst and bubble.
General there will be three situation;
1) First, Chip be affected with damp.
Solution:put the BGA and PCB into the oven about 4 to 8 hours, the temperature of oven setting is 80℃ to 100℃
2) Second, higher temperature
Solution: cut down the soldering time and turn up the bottom temperature to avoid chips directly heated too high.
3) Longer solder time
Solution: cut down the soldering time or move up the upper area a little. And let the bottom heat first, when the bottom temperature is 200 degree, move back the upper area. It can avoid the chip to heating too long.
4. Why the PCB will become black after soldering
General there will be two situation;
1) First,too much repeat welding times
2) Second, there is the problem of the flux paste quality.
Solution: use the better quality flux paste.
5. Why there will be the four corners rugged after the soldering.
General there will be two situation;
1) First, the PCB is not to be installed well or the PCB is out of shape.
Solution: after installing the PCB well. Please check that whether they are on the same line. And adjust the supporting screw to prevent the PCB sinking.
2) Second, the heat absorption rate of the bonding pad inconsistent res luting form the uneven copper foil lead
Solution: since the work environment of the BGA rework station is not sealed, so it cannot arrive the original reflow effect.. For this, we can turn up the temperature of the preheat infrared area. And change to a larger size nozzle to make the BGA chip has a large heating area. It can effectively prevent the absorption of the PCB copper foil too fast.
6. Why the bonding pad will drop when dismount the BGA chip.
General there will be several following question;
1) First,welding temperature or soldering time is not enough. In the case of tin ball haven't melt completely to remove the BGA chip
Solution: turn up the temperature or extend the soldering time.
2) Droped bonding pad point was empty on PCB board,not have copper foil lead on bottom bonding pad. Because there is no down-lead to fixed bonding pad the repair process will easy to fall off, but these soldering spot are useless,doesn’t affect use function.
This situation is common, there is no better way to avoid.
3) The problem of PCB board quality.Bonding pad tension and peeling resist coefficient no up to standard.
4) PCB board severity burn-in,in particular the PCB board to use more years.
7. What will you notice when choose the flux and the solder ball?
1) First, Our advice is that the operator should buy the special BGA flux paste. Ifuse the bad quality flux paste, there will be the missing solder and dry joint. And even make the PCB become yellow after soldering.( the storage temperature of the flux paste is not too high, or it will be no use)
2) Second, please pay attention to the date in produced.
a. Your inquiry related to our products or prices will be replied within 24hours.
b.Be Well-trained and experienced to answer all your enquires in fluent English
c. OEM&ODM, any your request we can help you to design and put into product.
d. Distributors are offered for your unique design and some our current models
e. Protection of your sales area, ideas of design and all your private information.
We always answer your questions: 24 hours a day, 7 days a week.
Send Inquiry to This Supplier
You May Also Like
-
Laptop CCD Camera BGA Rework Reballing StationUS$ 16,000 - 20,000MOQ: 1 Piece
-
Semi Automatic CCD Camera Optical Alignment PS3 Motherboards Repair Machine For PS3 BGA ChipUS$ 16,000 - 20,000MOQ: 1 Piece
-
Full-automatic BGA Rework Station For Mobile IC RepairingUS$ 19,000 - 20,000MOQ: 1 Piece
-
Automatic Desktop SMT Pick And Place MachineUS$ 1 - 20,000MOQ: 1 Piece
-
Iphone 5S Repair BGA Rework Station DH-A2US$ 5,000 - 6,000MOQ: 1 Piece
-
Automatic BGA Rework Station Chip Pick And Place MachineUS$ 5,000 - 6,000MOQ: 1 Piece
-
Mobile Phone/Laptop/Desktop/XBX360/PS3 Mainboard Repair KitUS$ 5,000 - 6,000MOQ: 1 Piece
-
Semi Auto Laser Positioning Optical Alignment Motherboard Repair ToolUS$ 5,000 - 6,000MOQ: 1 Piece
-
CCD Camera BGA Rework Station With PCB SupportUS$ 3,800 - 5,000MOQ: 1 Piece
-
BGA Reballing Machine Motherboards Repair BGA Phone ReballingUS$ 3,800 - 5,000MOQ: 1 Piece
