Contact Platform Support
Help CenterSemi-auto Bga Rework System for Laptop Bga Repair
Related Products
-
Soldering and Desoldering 2 in 1 Bga Rework StationUS$ 5,000 - 8,000MOQ: 1 Set -
Semi-auto BGA Chips Repairing Machine BGA Reballing Machine DH-A2NegotiableMOQ: 1 Set
-
Manual Optical Alignment BGA Rework Station DH-G200 With CCD CameraNegotiableMOQ: 1 Set
-
DH- A4 DingHua Bga Rework FactoryUS$ 16,000 - 20,000MOQ: 1 Piece
-
Laptop CCD Camera BGA Rework Reballing StationUS$ 16,000 - 20,000MOQ: 1 Piece
Specifications
Semi-auto bga rework system for laptop bga repairOptical alignment
CCD camera system
Laser positioning
Semi-auto bga rework system for laptop bga repair
Function of laptop bga repair station
NO |
Name |
Usage |
How to use |
1 |
Angel adjustment |
Adjust BGA angel |
Rotate button |
2 |
Top heating head |
Automatic heating equipment |
Manual or automatic through HD touch screen |
3 |
Laser positioning |
Indicate the BGA position |
Press the laser button |
4 |
Top hot air nozzle |
Control the hot air more evenly |
|
5 |
LED head light |
Lighting when working |
Press the LED button |
6 |
Bottom hot air nozzle |
Control the hot air more evenly |
|
7 |
IR plate |
Preheat the PCB board |
|
8 |
IR plate switch |
Switch of the IR plate |
Press the button |
9 |
X-axis microadjustment |
Adjust the PCB board X-axis direction |
Rotate the micrometer |
10 |
Y--axis microadjustment |
Adjust the PCB board Y-axis direction |
Rotate the micrometer |
11 |
Emergency stop |
Stop the machine immediately |
Press the button |
12 |
Laser button |
Control the laser position |
Press the button |
13 |
Start button |
Start heating |
Press the button |
14. |
LED button |
Control the LED head light |
Press the button |
15. |
LCD display |
Display the BGA picture |
Connect the power line |
16 |
Place system |
Placing the BGA chips |
Manual or automatic through HD touch screen |
17 |
PCB support |
Support the PCB boards |
|
18 |
Cross flow fan |
Cooling the PCB board after heating |
|
19 |
Lock screw |
Lock the PCB support |
Rotate the screw |
20 |
USB interface |
Transfer files |
USB connector |
21 |
Temperature sensor |
Test the outer temperature |
Connect the sensor |
22 |
Alignment brightness adjustment |
Adjust the alignment brightness |
Rotate the screw |
23 |
HD touch screen |
Operate the program |
|
Parameters of laptop bga repair system
Power supply |
AC220V±10% 50/60Hz |
Power |
6800W |
Top heater |
Hot air 1200W |
Bottom heater |
Hot air 1200W,Infrared 4200W |
Positioning |
V-groove, PCB support can be adjusted in any direction and with external universal fixture |
Temperature control |
K type thermocouple, closed loop control, independent heating |
Temp accuracy |
±2℃ |
PCB size |
Max 430*460 mm Min 22*22 mm |
Workbench fine-tuning |
±15mm forward/backward,±15mm right/left |
Camera magnification |
10x-100x |
BGA chip |
2*2-80*80mm |
Minimum chip spacing |
0.15mm |
External Temperature Sensor |
4(optional) |
Placement Accuracy |
±0.01MM |
Machine dimension |
(L*W*H): 75*102*100cm |
Packing dimension |
(L*W*H): 90*117*115cm |
NW/GW |
95/116kg |
Features of laptop computer repair equipment
1. Embedded industrial PLC, high definition touch screen, make the operation humanity, CPU control, and instant curve analysis function. Real-time display settings and actual temperature curve, which can also be used to analyze and correct the curve if necessary.
2. It uses high precise k-type thermocouple closed-loop control and automatic temperature compensation system, with CPU and temperature module to enable precise temperature deviation to add and subtract 2 degrees. Meanwhile, external temperature measurement connector enables temperature diction and accurate analysis of real time temperature curve.
3.V-groove PCB works for rapid, convenient and accurate positioning, which can meet all kinds of PCB board of positioning.
4. Flexible and convenient removable fixture on the PCB board can protect the PCB fringe devices from damaging and transmuting. It can also adapt to various BGA ‘s reworking.
5. Various sizes of BGA alloy nozzles, which can be adjusted 360 degree for easily installation and replacement.
6.Three temperature areas can independently heat and they are multiple temperature control, which can ensure best integration of different temperature areas. Heating temperature, time, slope, cooling and vacuum can all be set in the human-machine interface.
7.There are 8 stage temperature controls up and down. Massive storage of temperature curves which are accessible at any time according to different BGA. Curve analysis, setting and adjustment are also accessible via touch screen. Three heating areas adopt independent PID calculation to control heating process to enable more accurate temperature.
8.It uses high power cross-flow fan to enable fast cooling of PCB board and prevent PCB from deformation. There are also internal vacuum pump and external vacuum chuck, which can help to fetch the BGA chip.
9. Collocating with sound control "early warning" function. It can warn workers to make some relative preparation 5-10 seconds before the completion of uninstalling or welding. Cooling system will start after vertical wind stopped heating. When the temperature drops to normal temperature, the cooling process will stop automatically, so that the machine will not be aging after temperature heated up.
10.It use rocker controller for controlling the upper heater go up and down freely, and it also has the function for zooming the picture.
11.Picking and placing system, easier to operate and improve the working efficiency
12.CE approved, equipped with emergency stop switch and automatic power-off protection device when emergency happens.
1. The machine can be delivered by DHL, FedEx, TNT, EMS, UPS.
2. By sea or by air. Please provide us your nearest port.
3. The delivery date is within 7 days after the receipt of payment. If you are in urgent need of it,please kindly tell us.
Company profile
Shenzhen Dinghua Technology & Development Co., Ltd is a professional manufacturer of BGA rework station, rework tools and associated equipments, engaging in design, production, sales and service.We commit us to make the professional equipment, provide the high quality a perfect service for the customer. As one of pioneer in this industry, we continue to improve and innovate along with the market demands by absorbing the advanced development experience from home and abroad to adhering to our vision of ‘Professionalism, Honesty, Innovative and Responsibility’.
Science and technology are primary productive forces. Through teamwork, we achieved the core thermal-control technology with related patent. At the same time, our products cover 3 categories: high-end, mid-end and low-end for development and production using manual, semi-auto to fully automated processes. Our market had expanded into industries like: individual repair, factories, education, military and aerospace etc. And we had established the point-of sales and end service at locally and abroad.
Your satisfaction is our target, adhering to customer-focus, market oriented, and our company provides fist class products and high efficient services for customers through continuous innovation. We are honored to work with you to create a brighter future.
Our compay production bga rework station
Our customer to buy our bga rework station
1.All the machine will be well tested for 3 days before sending.
2.The whole machine is for 1-year warranty, the heating wire is for 3-years warranty
Bga rework station chip bond FAQ;
1. Missing solder
It will cause the off-normal with the manual counterpoint, and there will be a process of automatic correction between welding plate and the bga chip under the effect of the surface tension of the solder ball.
Chip uneven decline result from the uneven heating, or the early returning result in the run-off. If stop the reflow at this time, it will cause the missing solder. So we need to extend the time of soldering temperature. Or we also can increase the soldering temperature to make the degradation of the solder ball uniformity.
2. Short circuit.
When the solder ball arrive in the melting point and is at the status of liquid, the higher time,temperature and pressure will damage the surface tension and supporting role of the solder ball. And then resulting the short circuit. So we need to cut down the time of soldering appropriately, or we can lower the soldering temperature.
3. A chip burst and bubble.
General there will be three situation;
1) First, Chip be affected with damp.
Solution:put the BGA and PCB into the oven about 4 to 8 hours, the temperature of oven setting is 80℃ to 100℃
2) Second, higher temperature
Solution: cut down the soldering time and turn up the bottom temperature to avoid chips directly heated too high.
3) Longer solder time
Solution: cut down the soldering time or move up the upper area a little. And let the bottom heat first, when the bottom temperature is 200 degree, move back the upper area. It can avoid the chip to heating too long.
4. Why the PCB will become black after soldering
General there will be two situation;
1) First,too much repeat welding times
2) Second, there is the problem of the flux paste quality.
Solution: use the better quality flux paste.
5. Why there will be the four corners rugged after the soldering.
General there will be two situation;
1) First, the PCB is not to be installed well or the PCB is out of shape.
Solution: after installing the PCB well. Please check that whether they are on the same line. And adjust the supporting screw to prevent the PCB sinking.
2) Second, the heat absorption rate of the bonding pad inconsistent res luting form the uneven copper foil lead
Solution: since the work environment of the BGA rework station is not sealed, so it cannot arrive the original reflow effect.. For this, we can turn up the temperature of the preheat infrared area. And change to a larger size nozzle to make the BGA chip has a large heating area. It can effectively prevent the absorption of the PCB copper foil too fast.
6. Why the bonding pad will drop when dismount the BGA chip.
General there will be several following question;
1) First,welding temperature or soldering time is not enough. In the case of tin ball haven't melt completely to remove the BGA chip
Solution: turn up the temperature or extend the soldering time.
2) Droped bonding pad point was empty on PCB board,not have copper foil lead on bottom bonding pad. Because there is no down-lead to fixed bonding pad the repair process will easy to fall off, but these soldering spot are useless,doesn’t affect use function.
This situation is common, there is no better way to avoid.
3) The problem of PCB board quality.Bonding pad tension and peeling resist coefficient no up to standard.
4) PCB board severity burn-in,in particular the PCB board to use more years.
7. What will you notice when choose the flux and the solder ball?
1) First, Our advice is that the operator should buy the special BGA flux paste. Ifuse the bad quality flux paste, there will be the missing solder and dry joint. And even make the PCB become yellow after soldering.( the storage temperature of the flux paste is not too high, or it will be no use)
2) Second, please pay attention to the date in produced.
a. Your inquiry related to our products or prices will be replied within 24hours.
b.Be Well-trained and experienced to answer all your enquires in fluent English
c. OEM&ODM, any your request we can help you to design and put into product.
d. Distributors are offered for your unique design and some our current models
e. Protection of your sales area, ideas of design and all your private information.
We always answer your questions: 24 hours a day, 7 days a week.
Send Inquiry to This Supplier
You May Also Like
-
Semi Automatic CCD Camera Optical Alignment PS3 Motherboards Repair Machine For PS3 BGA ChipUS$ 16,000 - 20,000MOQ: 1 Piece
-
Full-automatic BGA Rework Station For Mobile IC RepairingUS$ 19,000 - 20,000MOQ: 1 Piece
-
Automatic Desktop SMT Pick And Place MachineUS$ 1 - 20,000MOQ: 1 Piece
-
Iphone 5S Repair BGA Rework Station DH-A2US$ 5,000 - 6,000MOQ: 1 Piece
-
Automatic BGA Rework Station Chip Pick And Place MachineUS$ 5,000 - 6,000MOQ: 1 Piece
-
Mobile Phone/Laptop/Desktop/XBX360/PS3 Mainboard Repair KitUS$ 5,000 - 6,000MOQ: 1 Piece
-
Semi Auto Laser Positioning Optical Alignment Motherboard Repair ToolUS$ 5,000 - 6,000MOQ: 1 Piece
-
CCD Camera BGA Rework Station With PCB SupportUS$ 3,800 - 5,000MOQ: 1 Piece
-
BGA Reballing Machine Motherboards Repair BGA Phone ReballingUS$ 3,800 - 5,000MOQ: 1 Piece
-
Cell Phone Motherboard Repairing Machine With Optical Alignment SystemUS$ 3,800 - 5,000MOQ: 1 Piece
