Contact Platform Support
Help CenterChina Chaosheng Electronics 800G Optical Module Complete Production Technology，800G Optical Module PCB
Product Spotlights
Related Products
-
China Chao ShengPCB Ultra Thick DPC Ceramic PCB Heavy Copper High Thermal Conductivity,High Current Heavy Copper Ultra Thick Ceramic PCBNegotiableMOQ: 1 Blade -
China Chaosheng Rogers Taconic High Speed Impedance Control PCB for Optical Module,QSFP-DD OSFP High Density Fine Line High Speed PCBNegotiableMOQ: 1 Blade
-
12 Layers, 2nd Order High-frequency Mixed Voltage, 2nd Step PCBNegotiableMOQ: 20 Units
-
16 Layers, 3rd Order High-frequency Mixed Voltage, 6 Step PCB，multi-layer High-frequency High-speed Material PCBNegotiableMOQ: 10 Units
-
8 Layers, 3rd Order HDI High-frequency Mixed Pressure Buried Copper PCB,8th Layer 3rd Order Optical Module Buried Resistance PCBNegotiableMOQ: 20 Units
1、 Core technology for complete production of 800G optical module (1) Core architecture and packaging process (two mainstream routes for mass production)
1. COB board chip packaging (mainstream in AI data centers, preferred for ultra high speed), full name Chip On Board, 800G core upgrade process: 1 Cancel the traditional TO-CAN split tube shell and directly mount the EML laser chip, PD detector, and TIA transimpedance amplifier on the high-frequency high-speed PCB/soft hard combination board with bare chips;
2. Short distance interconnection using gold/copper wire bonding greatly reduces high-frequency insertion loss and signal crosstalk, ensuring the integrity of 112Gbps single channel PAM4 signals
3. Paired with roll to roll R2R-FPC flexible interconnect board and ultra-thin soft hard bonding board to reduce size and power consumption (overall power consumption ≤ 15W);
4. Equipped with submicron level six axis fiber coupling alignment, high coupling efficiency and strong optical path stability
2. BOX box type split package (backup for long-distance coherent optical modules) independent metal tube packaging for discrete devices, airtight packaging filled with inert gas, moisture-proof and temperature resistant, mostly used for 800G long-distance coherent transmission (16QAM/PS-16QAM modulation), with the advantages of strong maintainability and good environmental tolerance. Short distance computing power centers are gradually being replaced by COB
3. Cutting edge advanced packaging: CPO co packaged Optics 800G to 1.6T iterative core technology, optical engine and switch ASIC chip integrated on the same substrate, extensively using high-frequency ceramic substrates, ultra-thin FPC soft boards, and micro high-density wiring, completely solving the bottleneck of high-speed signal routing loss.
（2） Optoelectronic chips and modulation technology
1. Optical chips: InP indium phosphide based EML electroabsorption modulation laser, DFB distributed feedback laser, high-speed PD photodetector; two Electronic chips: 7nm/5nm DSP digital signal processing chip, TIA transimpedance amplifier, laser driver chip;
3. Modulation format: PAM4 four level pulse amplitude modulation, single channel 112Gbps, 8-channel beamforming achieves a total bandwidth of 800G; The long-distance version adopts 800G PS-16QAM 4. Error correction algorithm: RS-FEC strong forward error correction, and the error rate is optimized to the level of 10 ⁻¹⁵.
1. Rigid high-frequency high-speed PCB board • Board: Megtron 6/Megtron 7, Rogers, Taconic low DK/Df low loss high-speed board, process: 8-12 layers of high-order HDI blind buried holes, LDI laser direct imaging, minimum line width of 3mil, strict control of differential impedance of 100 Ω± 5%, single end 50 Ω± 3%; Surface treatment: ENEPIG nickel palladium gold (preferred for automotive/optical module reliability), suppresses high-frequency oxidation contact loss. Solve the problem of high-speed interconnection without connectors between internal boards of the module;
Send Inquiry to This Supplier
You May Also Like
-
8 Layers, 2nd Order HDI High-frequency Mixed Voltage Buried Resistance PCB,8-layer 2nd Order Optical Module Embedded Gold Finger PCBNegotiableMOQ: 20 Units
-
8 Layers, 3rd Order HDI High-frequency Mixed Pressure Buried Capacitive Gold Finger PCBNegotiableMOQ: 20 Units
-
8 Layers of HDI High-frequency Mixed Pressure Buried Capacitor+buried Copper Block+gold Finger PCBNegotiableMOQ: 20 Units
-
6-layer High-frequency Multi-layer PCB，Taiyao TU872 High Speed MaterialNegotiableMOQ: 20 Units
-
16 High-frequency Multi-layer PCB,16 Layer High-frequency Mixed Voltage PCB，single-layer High-speed Material PCBNegotiableMOQ: 20 Units
-
6-layer High-frequency Multi-layer PCBNegotiableMOQ: 20 Units
-
18 High-frequency Multi-layer HDI PCB High-frequency Hybrid HDIPCBNegotiableMOQ: 1 Blade
-
Antimony Blind Gong HDI Multi-layer PCB,HDI High-frequency High-speed Material PCBNegotiableMOQ: 1 Blade
-
Complete Technical Solution for Four Layer/multi-layer Aluminum Based Thick Copper PCB for China Chaosheng Electronics New Energy VehiclesNegotiableMOQ: 1 Blade
-
Double Layer Transparent FR-4PCB,Multi Layer FR-4 Transparent PCB,Is the Cost of Producing Multi-layer Transparent CircuitNegotiableMOQ: 1 Unit
