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If you have any needs, please feel free to contact China Chaosheng Electronics Company. Please contact us as follows:
whatsapp：+8613528819118
Skype live: pcb-fpcb88@163.com
E-mail : sales@chaoshengpcb-fpc.com
Contact: Mank. Li
8th layer 3rd order high-frequency mixed pressure step HDIPCBHigh frequency high-speed material PCB, single-layer high-speed material PCB, double-layer high-frequency PCB, multi-layer high-frequency high-speed material PCB, HDI high-frequency high-speed material PCB, multi-layer high-frequency high-speed material mixed pressure PCB, HDI high-frequency high-speed material PCB
Product areas: Communication equipment, optical communication
Layers: 18 high-frequency multi-layer HDI PCB
Board thickness: 2.6mm
Size: 65 * 45mm/1 * 1pcs
Process structure:Rogers+Mitsui M24 Material from Japan
Impedance plus or minus 10% Inner and outer copper thickness 1OZ
Voltage withstand test: 100% short circuit test
The minimum mechanical hole is 0.15mm, laser hole/mm
Minimum line width and spacing 5/8mil
Surface treatment: Sunken gold 2U "+, no solder mask
Features: Frequency closed signal interference, improved transmission speed, stable signal
Usage: Communication equipment, optical communication, instruments, meters, antennas, radars, aerospace,
aviation, communication stations, 5G equipment, 5G communication, AI，
Artificial intelligence, transmitters and other products
Transport Package：Vacuum packaging+white paper insulation+moisture-proof beads+tin vacuum packaging+cardboard box
Main Product Structure of Chaosheng Group Company
2-80 layers of rigid circuit boards, 2-50 layers of flexible circuit boards and PCBA production
Chaosheng Group Company mainly produces product categories
High end double-sided, multi-layer, flexible, high-frequency, HDI interconnect, metal based, high thermal conductivity
metal based, ceramic, cut in metal based, cut in buried capacitor, cut in thick copper buried magnet, concave convex
step substrate, 5G high-speed board, thick copper, thick gold, high carbon resistance, double-sided multi-layer MiNiLED
, MiNiHDILED, MiNiOLED, IC carrier substrate, roll to roll FPC, long FPC, large-sized printed circuit board, halogen-free
material, high-frequency material, high-speed material, metal material, environmentally friendly circuit board, blind
buried hole circuit board, high thermal conductivity aluminum based, thermoelectric separation copper based, PDU
busbar, iron-based and metal based (core) mixed pressure plate, embedded copper buried copper. Buried resistance
buried capacitance buried ceramic bead board, ultra-thin BT board, ceramic substrate, IC carrier board, high-frequency
mixed voltage, high-speed board, differential impedance board, thick copper plate, thick gold plated board, HDI An
integrated OEM and ODM production factory for Anylayer, double-sided, multi-layer, HDI FPC, soft hard combination
HDI, roll to roll FPC, ultra long FPC, ultra large size PCB production and product design and development, software
development, special material printed circuit boards, etc.
The main application areas of PCB and PCBA products of Chaosheng Group Company
Communication terminals, communication stations, electronic communication, fiber optics, optical modules, backlight
sources, chip systems, communication equipment, communication instruments, computers, intelligent devices, intellig
ent control, system control, industrial power control, industrial equipment, testing instruments, testing instruments, SD
cards, SG cards, mobile phones, computers, various antennas, radars, automobiles, light sources, resistors, music equi
pment, playback equipment, banking equipment, medical instruments, medical equipment, aerospace, aviation, military
, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive
power supply, office equipment, digital products, computers and other application fields;
The main application areas of flexible circuit boards (FPC) and FPCA products of Chaosheng Group Company
Hard drives, printers, fax machines, scanners, sensors, mobile phones, connectors, modules, walkie talkie antenna cards,
high-end cameras, digital cameras, laser heads, CDs, medical devices, instruments, drives, automobiles, automotive
instruments, automotive drive disks, drivers, optical drives, medical devices, medical equipment, backlight sources,
modules, banking equipment, industrial instruments, LED light strips, military, aviation, aerospace, national defense
and other product fields.
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