LAIRD Tflex HD7.5 Thermal Gap Filler

FEATURES AND BENEFITS  

1. 7.5 W/mK thermal conductivity 

2. Low pressure versus deflection

3.  Minimizes board and component stress 

4. Low Outgassing and oil bleeding  

5. Large tolerance applications

Laird  Tflex HD7.5 gap filler is a new developed very soft silicone material in our high deflection  series. 

With a thermal conductivity of 7.5W/ mk, Tflex HD7.5 is designed to provide superior  pressure versus deflection characteristics. 

The material will provide minimal stress on components  during application while maintaining low thermal resistance. 

As a result, less mechanical and thermal  stresses will be experienced within your device. 

LAIRD Tflex HD7.5 gap filler is available in thickness from 1mm (0.040”) to 5mm (0.200”).