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Help CenterLaird Tflex 300 Tflex360 Thermal Gap Filler
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laird Tflex 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high rate of
compliancy allows the material to “totally blanket” the component, enhancing thermal transfer.
The material has a very low compression set enabling the pad to be reused many times.
laird Tflex360, in achieving its stellar compliancy, does not sacrifice thermal performance. With a
thermal conductivity of 1.2 W/mK, low thermal resistances can be achieved at low pressures.
laird Tflex 300H is offered with a hard, metallized liner option for easy handling and improved
rework. The metallized liner’s lower coefficient of friction also allows for easy assembly of parts
that must slide together, such as a card into a chassis.
laird Tflex360TG is offered with a cut-through resistant Tgard™ silicone liner. The TG liner offers a
guaranteed dielectric barrier, and easier part handling for mass production.
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