BERGQUIST LIQUI FORM TLF 6000

FEATURES AND BENEFITS 

● Thermal Conductivity: 6.0 W/m-K 

● Dispensable pre-cured gel

● Stable viscosity in storage and in the application 

● Excellent chemical stability and mechanical stability

BERGQUIST LIQUI FORM TLF 6000 thermally conductive gel interface material is designed to meet the demanding requirements 

in certain telecom market applications. Its unique formulation assures a balanced mix of high thermal conductivity, good dispensing 

efficiency and high thermal reliability. This material is specially designed to provide effective electronic component cooling capability for 

5G base station and remote antenna assembly where a highly reliable vertical gap stability is required. 

BERGQUIST LIQUI FORM TLF 6000 is pre-cured, requiring no mixing or refrigeration.

TYPICAL APPLICATIONS

● RRU/AAU/BBU in wireless in telecom wireless infrastructure 

● Filling various gaps between heat-generating devices to heat sinks

● Devices requiring low assembly pressure 

● High value assemblies with rework

TYPICAL PROPERTIES OF CURED MATERIAL Physical Properties 

Viscosity, Pa∙s: Low shear rate, 1.0 s -1 , ASTM D2196 1,500 

High shear rate, 100 s -1 , ASTM D5099 750 

Dispense Rate, EFD 30cc syringe, 90psi (1) , grams/minute (1) 12 

Outgassing, % total mass loss, ASTM E595, % 0.07 

Flammability @ 1.0 mm, tested in-house UL 94 V-0 

Electrical Properties 

Volume Resistivity, 5 V DC, ASTM D257, ohm-meter 3.25×10+10  

Dielectric Strength , ASTM D149, V/mm 5,400 

Dielectric Constant @ 1,000 Hz 5.7 

Thermal Properties Thermal Conductivity, ASTM D5470, W/(m-K) 6.0