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LOCTITE 3626M is designed for bonding of surface mounted devices to printed circuit boards prior to wave soldering.
This material is formulated to give excellent dot size and shape control when applied with a stencil using hand print or machine print process.
LOCTITE 3626M is halogen free and offers a very high thermal mechanical strength even at temperatures as high as 260ºC.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.4
Density, g/cm³ 1.3
Flash Point - See SDS
Yield Point, 25 °C, Pa 190-250LMS
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone
Casson model @ 0.4 - 30 s -1
TYPICAL PROPERTIES OF CURED MATERIAL
Cured for 30 minutes @ 150 °C
Physical Properties
Coefficient of Thermal Expansion,
ASTM D696, K -1:
Below Tg, µm/mºC 48
Above Tg, µm/mºC 184
Glass Transition Temperature (Tg), °C 138
Cure Speed vs. Time, Temperature
The following graph shows the rate of conversion with time under certain temperature.
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