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Help Center450*430 Mm 15W UV PCB Separator / FR4 Board Laser Depaneling Equipment ±20 μM Precision
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Laser PCB Separator with ±20 μm Precision for FR4 PCB Boards
PCB Separator / FR4 Board Laser PCB Depaneling Machine ±20 μM Precision
1.The laser process is completely software-controlled. Varying materials or cutting contours are easily taken into account through adapting the processing parameters and laser paths.
2.In the case of laser cutting with the UV laser, no appreciable mechanical or thermal stresses occur.
3.The laser beam merely requires a few µm as a cutting channel. More components can thus be placed on a panel.
4.The system software differentiates between operation in production and setting up processes. That clearly reduces instances of faulty operation.
5.The fiducial recognition by the integrated vision system is done in the latest version around 100% faster than before.
Laser Depanelizer Machine,YSATM-3L Feature:
1. High precision CCD automatic positioning, automatic focusing. Fast and accurate positioning, save time and no worries.
2. Friendly interface,Simple operation, easy to use, free application; Small size, Save more space; rigorous security design;
3. Reduce energy consumption, Cost savings.
4. Cost-effective, fast cutting speed, stable performance
Laser Depanelizer Machine, YSATM-3L Specification:
Parameter
| Main body of laser | 1480mm*1360mm*1412 mm |
| Weight of the | 1500Kg |
| Power | AC220 V |
| Laser | 355 nm |
| Laser |
Optowave 10W(US) |
| Material | ≤1.2 mm |
| Precisio | ±20 μm |
| Platfor | ±2 μm |
| Platform | ±2 μm |
| Working area | 600*450 mm |
| Maximum | 3 KW |
| Vibrating | CTI(US) |
| Power | AC220 V |
| Diameter | 20±5 μm |
| Ambient | 20±2 ℃ |
| Ambient | ＜60 % |
| The Machine | Marble |
Laser Depanelizer Machine Principle
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