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Back Grinding Wheels Are Used for the Thinning and Fine Grinding of the Silicon Wafer Miya@moresuperhard.com

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US$ 10 - 100 MOQ: 1 Piece
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Brand Name:
moresuperhard
Place of Origin:
China
Model Number:
as required
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Henan More Super Hard Products Co.,Ltd
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shanghai qingdao
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Brand Name moresuperhard
Place of Origin China
Model Number as required
Size as required

name: diamond backgrinding wheel

application: silicon wafer

Details

Introduction of back grinding wheels:

Diamond back grinding wheels are used for silicon wafer grinding. our advanced technology makes back grinding wheel possible to grind all types of semiconductor wafers with less subsurface damage.

During grinding, the grinding wheel and the wafer rotate about their own rotation axes simultaneously, and the wheel is fed towards the wafer along its axis. The rotation axis for the grinding wheel is offset by a distance of the wheel radius relative to the rotation axis for the wafer.

 

Applications of back grinding wheels:

Back thinning, rough grinding and fine grinding of silicon wafer.

Workpiece processed include silicon wafer of discrete devices, integrated chips (IC) and virgin etc.

Advantages of back grinding wheels:

good Self-dressing ability, Long life and low prices.

high heat conductivity, high wear resistance, and low coefficient.

it is highly desirable that grinding wheels generate only very low damage to ground wafers.

Applicable grinding machine:

The back grinding wheels can be used for the Japanese ,German, American, Korean and other grinders . Such as Okamoto , Disco, Strasbaugh and others grinding machine.

The Features of Back-side-Grinding-wheels:
1)Various directions of producing chemicals or metallurgical products. Provide with high efficiency of grinding and durable lifetime.
2) Stable manufactures technics. Provide with fine roughness of wafer surface.
3) Back Grinding wheel is the precision processing tool used in the process to grind unnecessary wafer back side and make the wafer back side with excellent backside roughness and uniform thickness, high technology is required to minimize wafer defect whose material is expensive and easy to be broken.

The specification of diamond back grinding wheels:

Model

Diameter (mm)

thickness (mm)

hole (mm)

 

6A2

175

30, 35

76

200

35

76

350

45

127

 

6A2T

195

22.5, 25

170

280

30

228.6

 

6A2T (three ellipses)

350

35

235

209

22.5

158

other size can ba made according to customers requirements

 

Our products Range:

 

1. vitrified bond/resin bond/Metal bond/Electroplated diamond grinding wheel & other diamond tools

2. PCD milling tools, pcd turning tools, pcd drilling tools, pcd engraving tools,pcd/pcbn inserts, pcd/pcbn cutting tools, pcd/pcbn grooving tools,CBN inserts

3. PCD/TSP diamond, CVD diamond tools, Natural diamond tools, diamond abrasive tools

4. diamond grinding&cutting discs, diamond cutting blade, diamond cup wheel, diamond dressers

5. Roller cutting tools, PDC cutters, pdc drill bits& pdc core bits

6. PCD tool grinder & pcd grinding machine

 

Please don't hesitate to contact me if you have any needs:miya AT

Our company also produces a series of diamond and CBN tools,welcome to consult and choose at any time


Product Tags: back grinding wheels , for the thinning and fine grinding , of the silicon wafer

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Henan More Super Hard Products Co.,Ltd
Main Markets
North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe, Central America, Northern Europe, Southern Europe, South Asia, Domestic Market
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