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Help CenterDIY PCB Cutter,PCB V Cut Sepecification With Laser Cutting Machine,CWVC-5L
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Laser Depaneling of PCBs,Depaneling-Circuit Boards,PCB & FPC Separator Equipment,CWVC-5L
DIY PCB Cutter,PCB V Cut Sepecification with Laser Cutting Machine,CWVC-5L Features:
Neat and smooth edge, no burr or overflow;
More quick and easy, shorten the delivery time;
More quick and easy, shorten the delivery time
High quality ,no distortion,surface clean& uniformity;
Gathering the CNC tech,laser tech,software tech…High accuracy,High speed;
Pre-camera vision product position registration and model check;
Coherent Avia NX UV laser with HurrySCAN head;
High capacity BOFA dust collecto;
User friendly Window based software;
PCB flexible product jig adjustable for different board size;
High resolution and accurate Z stage with auto-focus function;
Large area low friction front loading platform for sliding multiple product jigs;
Fully covered class 1 safety enclosure;
Able to do cutting and marking together;
Compact size.
PCB Laser Separator Equipment Specification:
Laser class |
1 |
Max. working area (X x Y x Z) |
300 mm x 300 mm x 11 mm |
Max. recognition area (X x Y) |
300 mm x 300 mm |
Max. material size (X x Y) |
350 mm x 350 mm |
Data input formats |
Gerber, X-Gerber, DXF, HPGL, |
Max. structuring speed |
Depends on application |
Positioning accuracy |
± 25 μm (1 Mil) |
Diameter of focused laser beam |
20 μm (0.8 Mil) |
Laser wavelength |
355 nm |
System dimensions (W x H x D) |
1000mm*940mm |
Weight |
~ 450 kg (990 lbs) |
|
Power supply |
230 VAC, 50-60 Hz, 3 kVA |
Cooling |
Air-cooled (internal water-air cooling) |
Ambient temperature |
22 °C ± 2 °C @ ± 25 μm / 22 °C ± 6 °C @ ± 50 μm |
Humidity |
|
Required accessoires |
Exhaust unit |
Working principle :
humidity sensor ( humidity and temperature signal ) → Microcomputer ( CPU Central Processing Unit ) → Heaters ( PTC heating module polymer material heating ) → Smart shape memory alloy ( alloy shape with temperature change ) → Balance spring ( general balance spring with alloy )
Description:
PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical stress to the parts. Large boards with heavy substrates absorb these stresses better, while these methods used on ever-shrinking and complex boards can result in breakage. This brings lower throughput, along with the added costs of tooling and waste removal associated with mechanical methods.
Increasingly, flexible circuits are found in the PCB industry, and they also present challenges to the old methods. Delicate systems reside on these boards and non-laser methods struggle to cut them without damaging the sensitive circuitry. A non-contact depaneling method is required and lasers provide a highly precise way of singulation without any risk of harming them, regardless of substrate.
If you need the machine,please contact us:
Skype/Email: s5@smtfly.com
WhatsApp/Wechat: +86 136 8490 4990
www.pcb-depaneling.com
www.pcb-depanelizer.com
Send Inquiry to This Supplier
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