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Help CenterNickel Copper Alloy Target NiCu Target Nickel Copper Sputtering Targets for PVD Coating
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Xinkang Produce Nickel Vanadium Alloy Target NiV Alloy NiV7 NiV93/7wt% Sputtering TargetsUS$ 100 - 185MOQ: 1 Piece -
Factory Supply Nickel Vanadium Sputtering Target NiV Alloy Target NiV7 NiV93/7wt% for PVD CoatingUS$ 85 - 185MOQ: 1 Piece
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Factory Supply Nickel Chromium Sputtering Target NiCr Alloy Target NiCr20 NiV80/20wt% for PVD CoatingUS$ 85 - 185MOQ: 1 Piece
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Nickel Copper (NiCu) Sputtering Target Customize Size for PVD CoatingUS$ 85 - 125MOQ: 1 Piece
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Nickel Iron Alloy Target NiFe Alloy NiFe20wt% NiFe90/10wt% Sputtering TargetsUS$ 85 - 255MOQ: 1 Unit
Composition and Purity (Most Common)
Alloy Ratio: e.g., Ni80Cu20 (most typical, used for corrosion resistance and electrode layers), Ni70Cu30, Ni55Cu45 (corresponding to Monel alloys).
Purity: e.g., 99.99%, 99.999%. Semiconductor or high-end optics require 4N (99.99%) or higher.
Impurity Content: Specific requirements include ppm-level control of impurities such as iron, cobalt, sulfur, and carbon.
Size and Shape
Shape: Circular target (diameter typically 1-12 inches), rectangular target (length and width customized according to sputtering equipment cavity), tubular target (rotating target).
Critical Dimensions: Thickness (e.g., 3mm, 6mm), inner/outer diameter (for annular or tubular targets), chamfer, screw hole position (requires matching equipment fixtures).
Tolerances: High-requirement customers will specify ±0.1mm or tighter.
Physical and Mechanical Properties
Relative Density: Requires >98% or >99.5%; higher densities result in less slag shedding during sputtering.
Grain Size: Average grain size
Crystal Orientation: Some high-end applications (e.g., magnetic thin films) require specific textures.
Welding Performance: Requirement for a backplate (copper or stainless steel), and weld bonding rate (e.g., >95% with ultrasonic testing).
Coating Process Requirements
Sputtering Method: DC or RF sputtering.
Film Characteristics: Resistivity, internal stress, adhesion, and substrate compatibility.
Application Keywords: Used for "diffusion barrier layers," "electrode layers," "magnetic thin films," "corrosion-resistant coatings," and "MEMS devices."
Quality and Testing Standards
Includes ICP-OES (composition analysis), GDMS (high-purity impurity detection), metallographic microscopy (grain size), and ultrasonic testing (internal defects, weld bonding rate) reports. Referenced standards include ASTM (American Society for Testing and Materials), GB/T (Chinese National Standard), or SEMI (Semiconductor Equipment and Materials International).
Packaging and Delivery
Packaging: Vacuum-packed (anti-oxidation), with built-in desiccant.
Delivery Condition: Unused; whether a Certificate of Analysis (COA) is provided.
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