14 layers, any order HDI IC carrier PCB Integrated chip IC carrier PCB

Product Name: IC Carrier Board

Material: ABF

Layers: 14 layers, any order HDI IC carrier PCB

Minimum line width/spacing: 25um/25um

Finished product size: 15 * 15mm

Surface technology: Nickel palladium gold

Copper thickness: 18um

Plate thickness: 1.60mm

Features: Integrated circuit, minimum wire size of 15um, ultra-thin, is a high-end IC substrate. As a high-end PCB (printed circuit board), it is a key bridge between integrated circuits (IC) and external circuits. Its core function is to achieve electrical connection, physical support, and functional coordination between IC chips and downstream electronic devices. It is an indispensable product in the electronics industry.

IC carrier board is the "high-end interface" that connects IC chips with external circuits. Its core function is to achieve stable output of chip functions through high-density electrical connections, physical support and protection, heat dissipation assistance, and signal integrity optimization. It is an indispensable key component in high-end electronic devices such as smartphones, computers, 5G communication, and artificial intelligence. With the improvement of chip integration (such as 3nm and 2nm processes), the circuit density and performance requirements of IC carrier boards are constantly increasing, becoming one of the high technical barriers in the semiconductor industry chain

Usage: Automotive lights LED、 High end chips such as computers, medical devices, mobile phones, artificial intelligence, AI, etc

Packaging substrate: IC carrier board, also known as packaging substrate, is developed on the basis of PCB board related technology, used to establish signal connections between IC and PCB, and is a key substrate for advanced packaging of integrated circuits.

High density: IC carrier boards have the characteristic of high density and need to meet the requirements of high-density integrated circuit packaging, such as high-density wiring, to achieve effective connection between chips and other components.

High precision: It requires high precision, strict requirements in terms of fine circuit, hole spacing size, and signal interference, and requires highly precise interlayer alignment technology, electroplating capability, drilling technology, etc.

High performance: With high temperature resistance and high-frequency performance, it can support the high-speed computing and data processing needs of more electronic devices in the future, providing stable electrical connections and good heat dissipation for chips.

Miniaturization and thinning: As a high-end PCB board, IC carrier boards have the characteristics of miniaturization and thinning to adapt to the development trend of modern electronic products being lightweight and portable.

Multi layer structure: Typically designed with multiple layers, it can support designs with 2 to 12 or even more layers. The more layers there are, the better the performance and meet the needs of different chip packaging.

Signal transmission: Ensuring efficient transmission of electrical signals is an important function of IC boards. To meet the requirements of high-speed signal transmission, optimized impedance control is needed to ensure stable signal transmission and low attenuation.

Thermal management: IC carrier boards usually need to cope with high operating temperatures, and thermal management is emphasized in design. Effective heat dissipation is achieved through special materials and structural design to extend component life.

Surface treatment: There are various surface treatment methods, such as immersion gold, OSP, HASL, etc., to meet different environmental and electrical performance requirements.

Packaging materials: According to different packaging materials, IC carrier boards can be divided into hard packaging substrates, flexible packaging substrates, and ceramic packaging substrates. The main materials for hard substrates are BT resin, ABF resin, MIS, etc.

Packaging process: Common packaging processes include wire bonding and flip chip bonding. Wire bonding is widely used in the packaging of RF modules, storage chips, and microelectromechanical system devices; Inverted packaging is widely used in the packaging of products such as CPUs, GPUs, and Chipsets.

Industry barriers: IC board manufacturing faces triple barriers of capital, technology, and customers, with high technical barriers and significant difficulties in research and mass production.

Application areas: Widely used in communication, computer, mobile terminal, industrial control and medical, automotive electronics, aerospace and other fields, different fields have their own characteristics in terms of the performance and requirements of IC carrier boards.

Chaosheng Group has significant advantages in IC board technology and quality. The following is a detailed introduction:

Technical aspects

Advanced process technology: Chaosheng Group has advanced blind gong and blind groove technology, which can ensure the precise connection of internal circuits of IC carrier boards, which is of great significance for the production of multi-layer boards and can meet the requirements of high-density circuit layout. At the same time, the surface of the circuit board is treated with immersion gold technology to present a uniform and bright golden color, which improves the oxidation resistance and conductivity, and is conducive to the reliable connection between the IC carrier board and chips and other components.

Rich product layer design capability: Its PCB business can achieve the production of 2-100 layer circuit boards. This extensive layer design capability can meet the needs of IC carrier boards with different levels of complexity, from simple double-layer carrier boards to highly complex multi-layer carrier boards, all within the production capacity range of Chaosheng Group.

High precision drilling technology: For the processing of small holes on IC substrates, Chaosheng Group adopts laser drilling technology, which can achieve high-precision small hole processing and meet the design requirements of dense circuits and small PAD pads. Its BT circuit board PAD is less than 15 microns, and the finished board thickness is ultra-thin, reaching 0.1 to 0.3 millimeters, reflecting its superb technical level in drilling and overall processing accuracy.

Material application and processing technology: Chaosheng Group uses special BT materials in IC board production, such as materials with high resin content and stable performance, which can prevent interference and withstand high temperatures of over 260 degrees Celsius. At the same time, the original resin plug holes were replaced with direct copper filling nickel palladium gold and other processes, optimizing the PCBA process structure, improving the heat dissipation of the product, reducing the expansion and contraction coefficient, and enhancing the performance and stability of the IC carrier board.

Automated production technology: Chaosheng Group's IC board factory in Japan has an automation production level of over 90%. Advanced automated production equipment and technology can improve production efficiency, ensure consistency and stability of product quality, and reduce the impact of human factors on product quality.

In terms of quality

A sound quality management system: The company has IE, ERP, Six Sigma, ISO quality management systems, and has passed quality system certifications such as UL, ISO9001, TS16949, ISO14000, QS8000 in the United States. From raw material procurement, production process control to finished product inspection, there are strict quality control processes to ensure that product quality meets international standards and customer requirements.

Strict testing process: Chaosheng Group is equipped with advanced AOI optical testing X - ray、 Optical automatic testing equipment and finished product function testing racks are used to conduct comprehensive inspections of IC carrier boards, including visual inspection, internal circuit testing, electrical performance testing, reliability testing, etc., to ensure that each IC carrier board meets quality standards and the product quality is stable and reliable.

Wide market recognition: Chaosheng Group's products are widely used in high-tech fields such as communication equipment, intelligent systems, new energy, medical devices, aerospace, etc. These fields have extremely high requirements for product quality. Chaosheng Group's ability to meet the needs of these fields indicates that the quality of its IC carrier board products has been widely recognized by the market.

Strong production strength guarantee: Chaosheng Group's annual output value exceeds 100 billion yuan, the annual output value of printed circuit boards reaches over 35 billion yuan, and the monthly production capacity reaches 650000 square meters. Strong production strength means that there are sufficient resources and capabilities to invest in quality control and ensure timely delivery of products, further reflecting the reliability of its product quality.

Process Capability Table
Technical ltem		MassProduct	Advanced Technology
		2015	2021	2025
Max.Layer Count		80 layer	100 layer	100 layer
PCB through hole board		2～80 layer	2～100 layer	2～100 layer
Maximum size through hole 1～2		37〞*98.50"	43.3〞*118.11"	43.3〞*118.11"
Minimum line width and spacing		10(0.40)	10(0.40)	7.50（0.30mm）
Minimum mechanical hole(mm)		12(0.50)	10(0.40)	8.50（0.35mm）
Maximum size through hole 4～22 layers		37〞*43.30"	43.3〞*43.30"	43.3〞*43.30"
Maximum size through hole 4～22 layers		31.50 ″*59"	31.50 ″*70.86"	31.50 ″*70.86"
Maximum size through hole 4～22 layers		10(0.40)	10(0.40)	7.50（0.30mm）
Minimum line width and spacing for multi-layer large-sized PCBs		10(0.40)	10(0.40)	7.50（0.30mm）
Maximum size of multi-layer through- hole : 4-22 layers with the smallest hole		12(0.50)	10(0.40)	8.50（0.35mm）
Maximum size HDI 4～36 layers		31.50 ″*55"	31.50 ″*55"	31.50 ″*55"
Minimum line width and line spacing of large size PCB		Through hole 12 / 12milHDI14 /14mil	Through hole 10/10 milHDI12 / 12mil	Through hole 8 / 8milHDI12 / 12mil
The largest board ruler 1 → the smallest hole of 18 layers		Through hole 0.50mmHDI :0.45mm	Through hole 0.50mm HDI : 0.45mm	Through hole 0.50mmHDI : 0.45mm
The layer number of FPC		1～36layer	1～60layer	1～60layer
Maximum size of flexible FPC		19.68〞*55"	28〞*59"	31.49〞*118.12"
Maximum size of flexible FPC with soft hard combination		19.68〞*55"	28〞*59"	31.49〞*118.12"
FPC (roll to roll) maximum size		19.68 ″*7874"	19.68 ″*7874"	19.68 ″*7874"
Maximum size of FPC single chip shipment		19.68 ″*118.11"	19.68 ″*196.8"	19.68 ″*196.80"
The layer number of FPC		2～18 layer	2～36 layer	2～42 layer
Maximum size of layered board		19.68 ″*35"	19.68 ″*43"	19.68 ″*43"
Number of through-hole layers		2～20layer	2～30 layer	2～40 layer
Hard and soft HDI layers		2～14 layer	2～18 layer	2～22 layer
Maximum size of soft and hard combination		19.68 ″*43"	19.68 ″*49"	19.68 ″*49"
FPC/soft-hard combination arbitrary interconnection HDI		4+X+4Interconnect HDI	5+X+5Interconnect HDI	6+X+6Interconnect HDI
HDIPCB layers		4～36layer	4～60layer	4～80 layer
Anylayer HDI PCB		4+X+4Interconnect HDI	5+X+5、Interconnect HDI	8+X+8、Interconnect HDI
HDIPCB maximum board size		24"*52"	43"*49"	43"*49"
Number of through hole layers of high frequency board		2～18 layer	2～36 layer	2～60 layer
HDI layers ofhighfrequency board		2～16 layer	2～24 layer	2～60layer
Maximum size of high frequency board		37 ″*43"	43 ″*49"	43 ″*49"
Number of ceramic plates		1-2 layer	1～4 layer	1～6 layer
Ceramic plate thickness		0.60mm-1.60mm	0.38mm-20.0mm	0.38mm-20.0mm
Maximum size of ceramic plate		100*150mm	150*190mm	150*650mm
Minimum aperture of ceramic plate		0.50mm	0.35mm	0.35mm
Minimum line width and line spacing of ceramic board		16/16mil	12/12mil	10/10mil
Number of layers of metal copper substrate		1-2 layer	1～4 layer	1～6 layer
Maximum line width and line spacing of metal iron substrate		12/12mil	4/4mil	4/4mil
Number of layers of metal aluminum substrateHDI		1-2 layer	1～4 layer	1～6 layer
Maximum size of metal substrate		37 ″*43"	25.59 ″*59"	25.59 ″*59"
The smallest hole of the metal substrate		0.50mm	0.35mm	0.35mm
Minimum line width and line spacing of metal substrate		8/8mil	4/4mil	4/4mil
Transparent FR-       4 material layers		1-2layer	1-2layer	1-8layer
Transparent FR-4 minimum hole		0.35mm	0.35mm	0.35mm
Transparent FR-4 minimum line width and spacing		4/4Mil	4/4Mil	3.5/3.5Mil
Transparent FR- 4 maximum size		23.63*47.25″	23.63*47.25 ″	23.63*47.25 ″
Number of tempered glass base layers		1-2layer	1-2layer	1-2layer
Minimum line width and spacing of glass		4/4Mil	4/4Mil	3.5/3.5Mil
The smallest hole in glass		0.35mm	0.35mm	0.35mm
Maximum size of glass		23.63*47.25″	23.63*47.25 ″	23.63*47.25 ″
Number of layers of transparent PETmaterial		1-2layer	1-2layer	1-2layer
Maximum size of transparent PET		19.68 ″*7874"	19.68 ″*7874"	19.68 ″*7874"
The company's main product types		Halogen free materials, high TG materials, high-frequency materials, high-speed materials, metal materials, glass materials, embedded materials, transparent FR- 4 materials, high thermal conductivity metals, high thermal conductivity aluminum substrates, environmentally friendly circuit boards, BT materials, ABF materials, and other imported materials, DU busbars, iron-based and metal based (core) mixed pressure plates, embedded buried copper, buried resistors, buried capacitors, buried ceramic bead plates, buried ceramics, ceramic mixed pressure plates, multi-layer ceramics, ultra-thin BT plates, ultra-thin PCBs, ultra-thin PCBs, multi-layer aluminum substrates, multi-layer ceramic plates, multi-layer ultra-thin HDI、  High frequency mixed voltage, differential impedance board, thick copper plate, gold-plated plate, high and low copper, high and low copper, high carbon resistance, transparent multilayer, glass plate, HDI arbitrary order (cross blind buried) Anylayer, flexible double-sided, flexible multilayer, soft hard combination HDI, roll to roll FPC, ultra long size, ultra large size board (single, double, multi-layer) PCB production and product design, product development, software development, etc
Main material		Rogers, Taikoni, Yaron, Mitsui, Isola, 3M, Taiyao, Taiguang, Tenghui, Shengyi,Lianmao, Nanya, Doosan, DuPont, Taihong, Hongren, Xinyang, Nippon Steel, Teflon,Yasen, Panasonic, RCC, Mitsui, Mitsubishi, Yingye, 3M, Kyocera, Jiuhao, Zhongci,Huaqing, Aishengda, Sliton, Kaichangde, Tongxin, Beige, Yalong, Taikoni,Hitachi, Laird System, etc
Main material categories		Halogen-free、halogenated、  high thermal conductivity, high TG135 、TG140、  TG150、  TG170、TG180、TG240、TG320
Build-up Material		FR-4 ，TG150,TG70,TG180
Conventional    plate  thickness     (mm)	Min.1-2L(mm)	0.10mm	0.10-12.0mm	0.10-18.0mm
	Min.4-10L(mm)	0.35mm	0.35mm～10.0mm	0.35-18.0mm
	Min.12L(mm)	0.43	0.38～10.0mm	0.38～18.0mm
	Min.16L(mm)	0.53	0.45～10.0mm	0.45～18.0mm
	Min.18L(mm)	0.63	0.51～10.0mm	0.51～18.0mm
	Min.52L(mm)	0.8	0.65～10.0mm	0.65～18.0mm
	MAX(mm)	3.5	12.0mm	18.0mm
Copper plate thickness and copper thickness	1-2 layerCU	700um	875um	875um
	Layers 4-20	4-12layer	4-16layer	4-22layer
	Inner layer copper thickness（um)	875um	1050um	1225um
	Outercopperthickness	210um	350um	525um
	Thick copper finished plate thickness	8.0mm	12.0mm	18.0mm
IC substrate	layerHDI	1-10layer	1-14layer	1-16layer
	Line width and spacing	50um	25um	15um
	copper thickness	8-10um	10-12um	12-15um
Min.CoreThickness um(mil)		254" (10.0)	0.15～254(10.0mm)	0.15～254(10.0mm)
Min.Build up Dielectric		38(1.5)	25(1.0)	25(1.0)
BaseCopperWeigh t	Inner Layer	1/4-8 OZ	1/4-0.30mm	1/4-0.30mm
	Out Layer	1/4-10 OZ	1/4-30 OZ	1/4-30 OZ
Gold thick		1～40u"	1～200u"	1～200u"
Nithick		76～127u"	1～250u"	1～250u"
Min.HOle/Land um(mil)		150/300(6/12)	100/200(4/8)	100/200(4/8)
Min.Laser via/landum(mil)		60/170(2.4/6.8)	50/150(2/6)	50/150(2/6)
Min. IVH、Hole size/landum(mil)		150/300(6/12)	100/200(4/8)	100/200(4/8)
DieletricThickness		38(1.5)	32(1.3)	32(1.3)
		125(5)	125(5)	125(5)
SKipvia		Yes	Yes	Yes
viaoNhie(laserviaon BuriedPTH)		Yes	Yes	Yes
Laser Hole Filling		Yes	Yes	Yes
Technicalltem		MassProduct	Advanced Technology
Hole depth/diameter	Through Hoie	25:01 :00	35:01 :00	40:01 :00
AspctRatio	MicroVia	0.8 :1	0.8 :1	0.8 :1
copperFilling Dimple Size		10(0.40)	5(0.20)	5(0.20)
Minimumouter line width/ spacing	Inner layer line width and spacing	38/38(1.5/1.5)	38/38(1.5/1.5)	38/38(1.5/1.5)
	PlatedLayerum(mil)	38/38(1.5/1.5)	38/38(1.5/1.5)	38/38(1.5/1.5)
BGAPitchmm(mil)		0.4	0.4	0.4
PHMin.Hole rlng um(mil)		75(3)	62.50(2.50	62.50(2.50
Line Width control	<2.5mil(mil)	±0.50	±0.50	±0.50
	2.5mil≤L/W<4mil	±0.50	±0.50	±0.50
	≤3mil(mil)	±0.60	±0.60	±0.60
SolderMask Registration um(mil)		±25	±25	±25
Solder masThickness	Lines Minum(mil)	10(0.40)	10(0.40)	10(0.40)
	Lines Minum(mil)	30(1.20)	30(1.20)	30(1.20)
	CopperMinum(mil)	10(0.40)	10(0.40)	10(0.40)
	CopperMax um(mil)	30(1.20)	30(1.20)	30(1.20)
Mln.Solder Mask opening um(mil)		250(10)	200(8)	200(8)
Structure	Stacking layer by layer	5+N+5	6+N+6	7+N+7
	Sequenetlal Bu il-up	42Any Layer	46Any Layer	60Any Layer
	Stacking layer by layer	N+N	N+N	N+N
		N+X+N	N+X+N	N+X+N
	Sequenetlal Lamination	4+(N+X+N)+4	5+(N+X+N)+5	6+(N+X+N)+6
Multi-layer stepped structure	Multi- layer stacking	5+N+5	6+N+6	7+N+7
	Sequenetlal Bu il-up	12Any Layer	16Any Layer	18Any Layer
	Multi- layer staircase	4 steps	6 steps	6 steps
Mechanical depth control drilling depth		2.0mm±0.08mm	2.0mm±0.08m	2.0mm±0.08m
Laser controlled depth drilling		0.6mm±0.08mm	0.8mm±0.08mm	1.0mm±0.08mm
/Min.HOle/Land um(mil)	linner um(mil)	150/300(6/12)	100/200(4/8)	100/200(4/8)
	Outer um(mil)	150/300(6/12)	100/200(4/8)	100/200(4/8)
Minimumburiedholediameter/solder pad		60/170(2.4/6.8)	50/150(2/6)	50/150(2/6)
SUBDielectricThic      kness	Mln.um(mil)	38(1.5)	32(1.3)	25(1.0)
	Max.um(mil)	125(5)	125(5)	125(5)
SKipvia		Yes	Yes	Yes
Via on hole(LaserViaon BuriePTH		Yes	Yes	Yes
Laser Hole Filling		Yes	Yes	Yes
Resin plug hole plate thickness	Min mm(mil)	0.35	0.35	0.35
	Max mm(mil)	3.2	3.2	3.2
Min mm(mil)		125(5)	110(4.50)	110(4.50)
Routing Depth control Accuracy um(mil)		±50um(mil)	±50um(mil)	±50um(mil)
Outine NC Rcuting Tolerance um(mil)		75(3)	75(3)	75(3)
Type of surface Finishing		OSP、  Sinking gold, lead-free tin, lead tin, electroplated gold fingers, electroplated gold (electroplated nickel hard gold, electroplated nickel soft gold), gold fingers+sinking gold, spray tin+gold fingers, OSP+electroplated gold, OSP+sinking gold, electroplated silver, electroplated silver, electroplated tin, gold coated silver, nickel free electroplated thick gold, nickel free electroplated thick silver, tin silver copper, OSP+gold fingers
EN Thickness Control(um)		>0.025-0.1um	>0.025-0.1um	>0.025-0.1um
OSOSP Thickness(um)		>0.20-0.50um	>0.20-0.50um	>0.20-0.50um
Ni Thickness(um)		>105⇢ 250um	>105⇢ 250um	>105⇢ 250um
Platinum thickness control		>0.025-5um	>0.025-5um	>0.025-5um
Lead/lead- free tin spraying thickness		>105⇢ 150um	>105⇢ 150um	>105⇢ 150um
Electrosilver		>105⇢ 140um	>105⇢ 140um	>105⇢ 140um
Thickness control of sinking silver		>105⇢ 140um	>105⇢ 140um	>105⇢ 140um
Tin thickness control		>105⇢ 140um	>105⇢ 140um	>105⇢ 140um
Min TestPAD	E/Tum(mil)	75(3)	75(3)	75(3)
	E/Tum(mil)	50(2)	50(2)	50(2)
	E/Tum(mil	25(1)	25(1)	25(1)
	E/Tum(mil)	150（6）	150（6）	150（6）
lmpedanceContro lTolerance	≧50ohm	± 10%	±8%	±8%
	≦50ohm	±50ohm	±50ohm	±50ohm
Finished board	Plate thickness≧0.15mm	≧ ± 10%	≧ ± 10%	≧ ± 10%
	Plate thickness≧0.15mm	≧ ±0.075%	≧ ±0.075%	≧ ±0.075%
Warpage		≤0.7%	≤0.5%	≤0.5%
The above are the conventional production skills of Chaosheng Group Company, and there are any unclear points. Please further communicate with our specialized technical personnel, and we will be happy to serve you! Welcome to our guide!