8 Layers HDIPCB

Company Profile The development history of Chaosheng Group shows a typical trajectory from its establishment to growth into a leader in the printed circuit board industry. A brief overview of Chaosheng Group, its subsidiaries, and specialty products: History and Background of Chaosheng Company: Chaosheng Group was founded in 1968, originating from Japan, under the name Chaosheng Technology Japan Kawasaki Co., Ltd. In 2012, the company implemented a shareholding reform, marking a shift towards more modern and standardized management. As a Sino Japanese Hong Kong joint venture, Chaosheng Group holds an important position in the Chinese circuit board manufacturing industry. Global factory distribution Zhejiang Kunying Electronic Technology Co., Ltd. (formerly renamed after the merger of Taiwan Kunying Electronics) was established in 2001, increasing the production and technical capabilities of Chaosheng Group in the field of circuit boards. Mainly focusing on high-end precision flexible circuit boards. Shenzhen Chaosheng Electronic Technology Co., Ltd. and Shenzhen Guangrui New Electronics Co., Ltd. (formerly known as Shenzhen Mingze Electronics Co., Ltd.) were established in 1993 and 2008 respectively, further expanding Chaosheng Group's layout in the Chinese market. We mainly provide supporting processing factories for customers in product design, software development, product research and development, and SMT surface mount processing. Chaosheng Group has multiple sales networks worldwide, covering France, the United Kingdom, Germany, Japan, Europe, Switzerland, Africa, North America, Austria, Taiwan, Hong Kong and other countries and regions, showcasing its global influence. Product Features and Applications: Widely used products: communication equipment, communication instruments, optical communication, infinite terminals, new energy, intelligent systems, medical devices, detection systems, aviation, aerospace, military, drones, robots, AI technology, 5G equipment, 5G communication, optical products, LED、 The high-tech fields such as communication, automotive, and home electronics reflect the technological strength and market insight of Chaosheng Group. Main materials: halogen-free materials FR-4， Polyimide PI materials, high TG materials, high-frequency materials, high-speed materials, metal materials, glass materials, embedded materials, transparent FR-4 materials, heat dissipation materials, embedded materials, high thermal conductivity metals, high thermal conductivity aluminum substrates, environmentally friendly circuit boards, BT materials, ABF materials, etc. Product structure: Metal based mixed pressure plate, embedded copper, buried resistance, buried capacitance, buried ceramic bead plate, buried ceramic, ceramic mixed pressure, multi-layer ceramic, BT board, ultra thick PCB, multi-layer aluminum substrate, high-frequency mixed pressure, impedance board, thick copper plate, thick gold plated board, high and low copper, high carbon resistance, transparent FR-4 multi-layer, glass plate Anylayer、 Single, double, multi-layer, soft and hard combination HDI, roll to roll FPC, ultra long and ultra large size boards, PCB production and product design and development, software development and SMT, PCBA and other integrated production factories The annual output value of Chaosheng Group exceeds 100 billion yuan, with the annual output value of printed circuit boards reaching over 65 billion yuan, demonstrating its strong production capacity and market competitiveness. With the continuous advancement of technology and changes in the market, Chaosheng Group needs to continue to pay attention to the dynamics of new technologies, products, and markets, strengthen research and development investment and innovation capabilities, in order to maintain its competitive advantage and industry position.