6layers of Copper With a Thickness of 210um, Thermoelectric Separation Aluminum BasedPCB
Product Spotlights
If you have any needs, please feel free to contact China Chaosheng Electronics Company. Please contact us as follows:
whatsapp:+8613528819118
Skype live: pcb-fpcb88@163.com
E-mail : sales@chaoshengpcb-fpc.com
Contact: Mank. Li
Product areas: Automotive new energy, high-power equipment, LED high-power lights
Layers: 4 layers of copper with a thickness of 210um, thermoelectric separation aluminum based
Board thickness: 2.89mm
Size: 268 * 132mm/1 * 1 pcs
Process structure: Caierde aluminum base+copper thickness 210um+Caierde 8W adhesive
Voltage withstand test: DC2500
The minimum mechanical hole is 0.65mm,
Minimum line width and spacing 10/8mil
Surface treatment: lead-free tin, green solder mask
Features: Heat dissipation, capable of withstanding high power currents
Usage: high-power equipment, high-power power supply, electrical appliances, high-power LED lights and other products
Main Product Structure of Chaosheng Group Company
High thermal conductivity copper based+8W adhesive PCB,High thermal conductivity 8W thick copper based PCB,Thermoelectric separation copper based PCB,Thermoelectric separation multi-layer copper based PCB,Thermoelectric separation high thermal conductivity thick copper PCB
2-80 layers of rigid circuit boards, 2-50 layers of flexible circuit boards and PCBA production
Chaosheng Group Company mainly produces product categories
High end double-sided, multi-layer, flexible, high-frequency, HDI interconnect, metal based, high thermal conductivity metal based, ceramic, cut in metal based, cut in buried capacitor, cut in thick copper buried magnet, concave convex step substrate, 5G high-speed board, thick copper, thick gold, high carbon resistance, double-sided multi-layer MiNiLED, MiNiHDILED, MiNiOLED, IC carrier substrate, roll to roll FPC, long FPC, large-sized printed circuit board, halogen-free material, high-frequency material, high-speed material, metal material, environmentally friendly circuit board, blind buried hole circuit board, high thermal conductivity aluminum based, thermoelectric separation copper based, PDU busbar, iron-based and metal based (core) mixed pressure plate, embedded copper buried copper. Buried resistance buried capacitance buried ceramic bead board, ultra-thin BT board, ceramic substrate, IC carrier board, high-frequency mixed voltage, high-speed board, differential impedance board, thick copper plate, thick gold plated board, HDI An integrated OEM and ODM production factory for Anylayer, double-sided, multi-layer, HDI FPC, soft hard combination HDI, roll to roll FPC, ultra long FPC, ultra large size PCB production and product design and development, software development, special material printed circuit boards, etc.
The main application areas of PCB and PCBA products of Chaosheng Group Company
Communication terminals, communication stations, electronic communication, fiber optics, optical modules, backlight sources, chip systems, communication equipment, communication instruments, computers, intelligent devices, intelligent control, system control, industrial power control, industrial equipment, testing instruments, testing instruments, SD cards, SG cards, mobile phones, computers, various antennas, radars, automobiles, light sources, resistors, music equipment, playback equipment, banking equipment, medical instruments, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products, computers and other application fields;
The main application areas of flexible circuit boards (FPC) and FPCA products of Chaosheng Group Company
Hard drives, printers, fax machines, scanners, sensors, mobile phones, connectors, modules, walkie talkie antenna cards, high-end cameras, digital cameras, laser heads, CDs, medical devices, instruments, drives, automobiles, automotive instruments, automotive drive disks, drivers, optical drives, medical devices, medical equipment, backlight sources, modules, banking equipment, industrial instruments, LED light strips, military, aviation, aerospace, national defense and other product fields.
FAQ
Question Point Answer
Q: What information is required for PCB CEGSATE: Gberber files for PCB production, product process instructions, such as material requirements, surface treatment requirements, finished product thickness requirements, PCB stack structure diagram for advanced products, copper thickness requirements for each layer, sample quantity requirements, batch order requirements, product application fields, and other related information are required
Q: What information does PCBA need to provide CEGSATE: BOM report is required (including the brand, specifications, and model of the components), X and Y coordinate numbers of PCBA components, and processing requirements: Do we need to purchase the components on our behalf? Or customer supplied components? Do you need software burning? What is the required quantity? What is the monthly demand and other detailed information.
Question: Is my file secure? CEGSATE: Your files are very secure, and we protect intellectual property rights for our clients throughout the entire process. All files provided by the customer will never be shared with any third party.
Q: What is the minimum order quantity? CESGATE: There is no minimum order quantity in POE. We are able to handle small and large batches flexibly.
Q: Do you have any other services? CESGATE: We mainly focus on PCB+FPC production+SMT+assembly PCBA+component procurement services; In addition, we can also provide programming, testing, software burning, wiring, and shell assembly services; And product design, product development, software development
Q: What is your inspection method? How do you control the quality? CESGATE: In order to ensure the quality of PCB and FPC products, flying pin testing is usually used for samples and small batches; The inner circuit undergoes AOI optical inspection, online AOI inspection, and the finished product undergoes 100% inspection through E-SET testing rack. The appearance undergoes 100% inspection through fully automatic finished product inspection equipment and FQC. PCBA undergoes automatic optical inspection (AOI), BGA part X-Ray 100% radiographic inspection, and first article inspection (FAI). PCBA products that require software burning undergo 100% full testing through finished product testing rack according to product functional requirements.
Send Inquiry to This Supplier
You May Also Like
-
4-layer 15OZ Thick Copper+copper Bar+copper Based Charging Pile PCB,High Thermal Conductivity Copper Based+8W Adhesive PCBNegotiableMOQ: 5 Units
-
4-layer High-voltage Thermoelectric Separation Thick Copper Aluminum SubstrateNegotiableMOQ: 5 Units
-
2layer High-voltage Thermoelectric Separation Thick Copper Aluminum SubstratePCBNegotiableMOQ: 5 Units
-
2-layer Thermoelectric Separation High Current Multi-layer Aluminum Based PCBNegotiableMOQ: 200 Units
-
4 Thick Copper High Thermal Conductivity Thermoelectric Separation Aluminum BasePCBNegotiableMOQ: 10 Units
-
4-layer Thermoelectric Separation High Current Multi-layer Aluminum Based PCB,Thermoelectric Separation Aluminum Based Circuit Board PCBNegotiableMOQ: 10 Units
-
12 Layers, 2nd Order High-frequency Mixed Voltage, 2nd Step PCBNegotiableMOQ: 20 Units
-
16 Layers, 3rd Order High-frequency Mixed Voltage, 6 Step PCB,multi-layer High-frequency High-speed Material PCBNegotiableMOQ: 10 Units
-
8 Layers, 3rd Order HDI High-frequency Mixed Pressure Buried Copper PCB,8th Layer 3rd Order Optical Module Buried Resistance PCBNegotiableMOQ: 20 Units
-
8 Layers, 2nd Order HDI High-frequency Mixed Voltage Buried Resistance PCB,8-layer 2nd Order Optical Module Embedded Gold Finger PCBNegotiableMOQ: 20 Units