4-layer thermoelectric separation high current multi-layer aluminum based PCB,Thermoelectric separation aluminum based circuit board PCB

Product field: Automotive new energy and LED high-power lights

Layer number: 4 thick copper high thermal conductivity thermoelectric separation aluminum base

Board thickness: 2.56mm

Size: 265 * 128mm/1 * 1 pcs

Process structure: aluminum base with a thickness of 5OZ copper and 8W adhesive with a thickness of 5OZ

Voltage withstand test: DC1800

The minimum mechanical hole is 0.35mm,

Minimum line width and spacing of 12/12mil

Surface treatment: lead-free tin, green solder mask

Features: Heat dissipation, capable of withstanding high power currents

Usage: high-power equipment, high-power power supply, electrical appliances, high-power LED lights and other products

Main Product Structure of Chaosheng Group Company

2-80 layers of rigid circuit boards, 2-50 layers of flexible circuit boards and PCBA production

Chaosheng Group Company mainly produces product categories

High end double-sided, multi-layer, flexible, high-frequency, HDI interconnect, metal based, high thermal conductivity metal based, ceramic, cut in metal based, cut in buried capacitor, cut in thick copper buried magnet, concave convex step substrate, 5G high-speed board, thick copper, thick gold, high carbon resistance, double-sided multi-layer MiNiLED, MiNiHDILED, MiNiOLED, IC carrier substrate, roll to roll FPC, long FPC, large-sized printed circuit board, halogen-free material, high-frequency material, high-speed material, metal material, environmentally friendly circuit board, blind buried hole circuit board, high thermal conductivity aluminum based, thermoelectric separation copper based, PDU busbar, iron-based and metal based (core) mixed pressure plate, embedded copper buried copper. Buried resistance buried capacitance buried ceramic bead board, ultra-thin BT board, ceramic substrate, IC carrier board, high-frequency mixed voltage, high-speed board, differential impedance board, thick copper plate, thick gold plated board, HDI An integrated OEM and ODM production factory for Anylayer, double-sided, multi-layer, HDI FPC, soft hard combination HDI, roll to roll FPC, ultra long FPC, ultra large size PCB production and product design and development, software development, special material printed circuit boards, etc.

The main application areas of PCB and PCBA products of Chaosheng Group Company

Communication terminals, communication stations, electronic communication, fiber optics, optical modules, backlight sources, chip systems, communication equipment, communication instruments, computers, intelligent devices, intelligent control, system control, industrial power control, industrial equipment, testing instruments, testing instruments, SD cards, SG cards, mobile phones, computers, various antennas, radars, automobiles, light sources, resistors, music equipment, playback equipment, banking equipment, medical instruments, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products, computers and other application fields;

The main application areas of flexible circuit boards (FPC) and FPCA products of Chaosheng Group Company

Hard drives, printers, fax machines, scanners, sensors, mobile phones, connectors, modules, walkie talkie antenna cards, high-end cameras, digital cameras, laser heads, CDs, medical devices, instruments, drives, automobiles, automotive instruments, automotive drive disks, drivers, optical drives, medical devices, medical equipment, backlight sources, modules, banking equipment, industrial instruments, LED light strips, military, aviation, aerospace, national defense and other product fields.

FAQ

Question Point Answer

Q: What information is required for PCB CEGSATE:
Gberber files for PCB production, product process instructions, such as material requirements, surface treatment
 requirements, finished product thickness requirements, PCB stack structure diagram for advanced products, copper
thickness requirements for each layer, sample quantity requirements, batch order requirements, product application
fields, and other related information are required

Q: What information does PCBA need to provide CEGSATE:
BOM report is required (including the brand, specifications, and model of the components), X and Y coordinate num
bers of PCBA components, and processing requirements: Do we need to purchase the components on our behalf? Or
customer supplied components? Do you need software burning? What is the required quantity? What is the monthly
demand and other detailed information.

Question: Is my file secure? CEGSATE:
Your files are very secure, and we protect intellectual property rights for our clients throughout the entire process.
All files provided by the customer will never be shared with any third party.

Q: What is the minimum order quantity?
CESGATE: There is no minimum order quantity in POE. We are able to handle small and large batches flexibly.

Q: Do you have any other services? CESGATE:
We mainly focus on PCB+FPC production+SMT+assembly PCBA+component procurement services; In addition,
we can also provide programming, testing, software burning, wiring, and shell assembly services; And product
design, product development, software development

Q: What is your inspection method? How do you control the quality?
CESGATE: In order to ensure the quality of PCB and FPC products, flying pin testing is usually used for samples
and small batches; The inner circuit undergoes AOI optical inspection, online AOI inspection, and the finished p
roduct undergoes 100% inspection through E-SET testing rack. The appearance undergoes 100% inspection thro
ugh fully automatic finished product inspection equipment and FQC. PCBA undergoes automatic optical inspection
(AOI), BGA part X-Ray 100% radiographic inspection, and first article inspection (FAI). PCBA products that require so
ftware burning undergo 100% full testing through finished product testing rack according to product functional req
uirements.