Contact Platform Support
Help CenterParker Chomerics THERM-A-GAP Gel 30
Related Products
-
LORD SC-320 LVH Thermally Conductive Silicone EncapsulantUS$ 1 - 2MOQ: 5 Units -
LORD 320/322 Epoxy AdhesiveUS$ 1 - 2MOQ: 5 Units
-
LORD SC-324 Thermally Conductive Silicone EncapsulantUS$ 1 - 2MOQ: 5 Pieces
-
BERGQUIST HF650P HI-FLOW 650P HI-FLOW THF 1500PUS$ 1 - 2MOQ: 1 Roll
-
BERGQUIST GP5000S35 GAP PAD 5000S35 GAP PAD TGP 5000US$ 1 - 2MOQ: 2 Sheets
Parker Chomerics THERM-A-GAP Gel 30 is a fully cured dispensable gel designed to eliminate time consuming hand assembly, decreasing installation costs and reducing customer manufacturing and purchasing (logistical) complexity. It requires no mixing or curing, providing superior design flexibility. Product Attributes: 1.Provides low thermal impedance at thin and thick gaps, allowing use of common heat spreaders 2.Proven reliability in extreme temperature cycling and shock & vibration 3.Deflects easily under very low compressive forces, decreasing stress on components thus decreasing component failures. 4.Accommodates a variety of bond line thicknesses for application to multiple devices 5.Successfully used to fill a variety of different gap thickness
Send Inquiry to This Supplier
You May Also Like
-
Laird Tflex 300 Tflex360 Thermal Gap FillerUS$ 1 - 2MOQ: 10 Pieces
-
BERGQUIST SP400 SIL PAD 400 SIL PAD TSP 900US$ 1 - 2MOQ: 1 Roll
-
Laird Tgard K52 Thermally Conductive InsulatorsUS$ 1 - 2MOQ: 10 Pieces
-
BERGQUIST GF3500S35 GAP FILLER TGF 3600 GAP FILLER 3500S35 Thermal PasteUS$ 1 - 2MOQ: 5 Units
-
BERGQUIST PP400 Poly-Pad 400US$ 1 - 2MOQ: 1 Roll
-
BERGQUIST HF300P HI-FLOW THF 1600P HI-FLOW 300PUS$ 1 - 2MOQ: 1 Roll
-
BERGQUIST SP900S SIL PAD 900S SIL PAD TSP 1600SUS$ 1 - 2MOQ: 1 Roll
-
BERGQUIST SPK10 SIL PAD K-10 SIL PAD TSP K1300US$ 1 - 2MOQ: 1 Roll
-
BERGQUIST GP1500 GAP PAD TGP 1500 GAP PAD 1500US$ 0.1 - 0.6MOQ: 10 Pieces
-
BERGQUIST GPVO GAP PAD VO GAP PAD TGP 800VOUS$ 0.2 - 0.8MOQ: 10 Pieces
