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Help CenterBERGQUIST GPVO GAP PAD VO GAP PAD TGP 800VO
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BERGQUIST GPVO GAP PAD VO GAP PAD TGP 800VO
BERGQUIST GAP PAD TGP 800VO is a cost-effective, thermally conductive
interface material. The material is a filled,thermally conductive polymer
supplied on a rubber-coated fiberglass carrier allowing for easy material
handling. The conformable nature of BERGQUIST GPVO allows the pad to fill
in air gaps between PC boards and heat
sinks or a metal chassis.
BERGQUIST GAP PAD VO
Typical Applications Include:
• Telecommunications
• Computers and peripherals
• Power conversion
• Between heat-generating semiconductors and a heat sink
• Areas where heat needs to be transferred to a frame, chassis, or other type of
heat spreader
• Between heat-generating magnetic components and a heat sink
Configurations Available:
• Sheet form and die-cut parts
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