BERGQUIST GPVO GAP PAD VO GAP PAD TGP 800VO

BERGQUIST GPVO GAP PAD VO GAP PAD TGP 800VO

BERGQUIST GAP PAD  TGP 800VO is a cost-effective, thermally conductive

interface material. The material is a filled,thermally conductive polymer 

supplied on a rubber-coated fiberglass carrier allowing for easy material

handling. The conformable nature of BERGQUIST  GPVO allows the pad to fill

in air gaps between PC boards and heat

sinks or a metal chassis.

BERGQUIST GAP PAD VO

Typical Applications Include:

• Telecommunications

• Computers and peripherals

• Power conversion

• Between heat-generating semiconductors and a heat sink

• Areas where heat needs to be transferred to a frame, chassis, or other type of

heat spreader

• Between heat-generating magnetic components and a heat sink

Configurations Available:

• Sheet form and die-cut parts