BERGQUIST GP1500 GAP PAD TGP 1500 GAP PAD 1500

BERGQUIST GP1500 GAP PAD TGP 1500  GAP PAD 1500

BERGQUIST GAP PAD 1500 Thermally Conductive, Unreinforced Gap Filling Material

BERGQUIST  GAP PAD TGP 1500 has

an ideal filler blend that gives it a low-

modulus characteristic, which maintains

optimal thermal performance yet still

allows for easy handling. The natural

tack on both sides of the material

allows for good compliance to adjacent

surfaces of components, minimizing

interfacial resistance.

BERGQUIST GP1500 

Typical Applications Include:

• Telecommunications

• Computers and peripherals

• Power conversion

• Memory modules / chip scale packages

• Areas where heat needs to be transferred to a frame chassis or other type

of heat spreader

Configurations Available:

• Sheet form and die-cut parts