BERGQUIST GP1000SF GAP PAD TGP 1100SF

FEATURES AND BENEFITS 

1. Thermal Conductivity: 0.9 W/m-K 

2. No silicone outgassing 

3. No silicone extraction 

4. Reduced tack on one side to aid in application assembly 

5. Electrically isolating

BERGQUIST GAP PAD TGP 1100SF is a thermally conductive, electrically insulating, silicone-free polymer specially designed for silicone-sensitive applications. 

The material is ideal for applications with high standoff and flatness tolerances.

BERGQUIST GAP PAD 1000SF is reinforced for easy material handling and added durability during assembly. 

The material is available with a protective liner on both sides of the material. The topside has reduced tack for ease of handling.

BERGQUIST GP1000SF Typical Applications Include: 

1.Digital disk drives and CD-ROMs 

2.Automotive modules 

3.Fiber optics modules Configurations Available

4.Sheet form • Die-cut parts