BERGQUIST Gap Pad 2500S20 is a thermally conductive,reinforced material rated at a thermal
conductivity of 2.4 W/m-K.The material is a filled-polymer material yielding extremely soft,
elastic characteristics.The material is reinforced to provide easy handling,converting,added
electrical isolation and tear resistance.BERGQUIST GP2500S20 is well suited for low-pressure
applications that typically use fixed standoff or clip mounting.The material maintains a
conformable,yet elastic nature that allows for excellent interfacing and wet-out characteristics,
even to surfaces with high roughness and/or topography.GAP PAD TGP 2400 is offered
with inherent natural tack on both sides of the material allowing for stick-in-place characteristics during
application assembly.The material is supplied with protective liners on both sides.The top
side has reduced tack for ease of handling.
BERGQUIST GP2500S20 Typical Applications
• Between processors and heat sinks
• Between graphics chips and heat sinks
• DVD and CDROM electronics cooling
• Areas where heat needs to be transferred to a frame,chassis or other type of heat spreader
Configurations Available:
• Sheet form and die-cut parts
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