Continuous Furnace for Glass and Metal Encapsulation of Electronic Components

Applications

Electronic packaging of glass and metal, chip soldering, metal components and other products under protective atmosphere fusing, brazing, oxidation, annealing, metallization and other firing processes.

Features

1. Working temperature 200-1050℃.

2. Unique atmosphere protection system design, furnace atmosphere up to 10PPM.

3. Ultra-lightweight fiber material, heat preservation, energy saving and environmental protection.

4. Japan imported temperature controller with high precision, corresponding fast control and stability.

5. Ultrasonic cleaning mesh belt, high cleanliness.

6. Atmosphere: nitrogen, nitrogen-hydrogen mixture, nitrogen-oxygen mixture.