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TRICONEX 2658
TRICONEX 2658
TRICONEX 2658
TRICONEX 2658 Invensys eliminates obstacles in cathode contact
Compared to the 91mm chip that has been produced for over 20 years, the TRICONEX 2658 project aims to use lower thermal impedance and larger effective area of 94mm diameter chips. The 94mm platform was originally designed specifically for STATCOM applications from 2014 to 2016.
The shell platforms of 94 mm and 91 mm are the same externally; TRICONEX 2658 is only internally different. The gate connection of the 91 mm chip is located approximately half of the device radius. The gate connected from the radial outer side to the chip inevitably means guiding it through the cathode plate, which forms the main electrode and thermal contact on the cathode side. The gate through hole can introduce obstacles in the circuits and thermal circuits of 91 mm devices.
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