- QINGDAO DOCBOND NEW MATERIAL CO.LTD
- China Manufacturer with main products:Water adhesive for fuel cell bipolar plate ,sealant for gas path of fuel cell bipolar plate ,microporous plugging agent for graphite bipolar plate ,composite graphite bipolar plate
Home > Products > electronic glue > DOCBOND|High Thermal Conductivity Epoxy Adhesive
DOCBOND|High Thermal Conductivity Epoxy Adhesive
- 1000 Bag / Bags per Month
- Qingdao
- 7 days
Product Details
| Brand Name: | High Thermal Conductivity Epoxy Adhesive | Place of Origin: | China | Model Number: | DB118 |
| Type: | Epoxy Adhesive | Classification: | Hot Melt Adhesives | Usage: | Other, High temperature waterproof seal |
| Main Raw Material: | Epoxy |
Product Description
DB118
This product is a one-component epoxy resin adhesive with high thermal conductivity, which is the best matching adhesive for thermal bonding of chips. Applicable to all kinds of electronic products, characterized by rapid thermal curing, and easy to apply. Upon cure, it has high bonding strength, good thermal conductivity, low shrinkage, low moisture absorption, good insulation performance, etc., which can reduce the working temperature of the chip, extend the life of the chip
Contact Us
- QINGDAO DOCBOND NEW MATERIAL CO.LTD
- Contact nameKang Cheng Chat Now
- Phone86-0532-81700039
- Address628 Jiushui East Road，Laoshan District Qingdao,Shandong
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