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Help CenterDOCBOND|High Thermal Conductivity Epoxy Adhesive
Negotiable
MOQ: 50 Bags (Price negotiable depending on order volume and customization)
Key Specifications
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Brand Name:
High Thermal Conductivity Epoxy Adhesive
Place of Origin:
China
Model Number:
DB118
Payment & Shipping
Payment Methods:
Port of Shipment:
Qingdao
Delivery Detail:
7 days
Related Products
Brand Name
High Thermal Conductivity Epoxy Adhesive
Place of Origin
China
Model Number
DB118
Type
Epoxy Adhesive
Classification
Hot Melt Adhesives
Usage
Other, High temperature waterproof seal
Main Raw Material
Epoxy
DB118
This product is a one-component epoxy resin adhesive with high thermal conductivity, which is the best matching adhesive for thermal bonding of chips. Applicable to all kinds of electronic products, characterized by rapid thermal curing, and easy to apply. Upon cure, it has high bonding strength, good thermal conductivity, low shrinkage, low moisture absorption, good insulation performance, etc., which can reduce the working temperature of the chip, extend the life of the chip
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Business Type
Manufacturer
Year Established
2020
Factory Size
Below 1,000 square meters
Total Employees
101 - 200 People
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