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Negotiable
MOQ: 50 Bags (Price negotiable depending on order volume and customization)
Key Specifications
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Brand Name:
Low Temperature Curing Adhesive
Place of Origin:
China
Model Number:
DB291
Payment & Shipping
Payment Methods:
Port of Shipment:
Qingdao
Delivery Detail:
7 days
Related Products
Brand Name
Low Temperature Curing Adhesive
Place of Origin
China
Model Number
DB291
Classification
Hot Melt Adhesives
Usage
Other, High temperature waterproof seal
Main Raw Material
Acrylic
DB291
This product is a single component, low temperature fast heat curing modified epoxy resin adhesive. Excellent adhesion between many different types of materials at lower temperatures and in a very short time. The product has excellent working performance and high storage stability. This product is suitable for low-temperature curing process, mainly used for bonding heat-sensitive components,suitable for memory cards, CCD/CMOS, LED backlights etc.
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Business Type
Manufacturer
Year Established
2020
Factory Size
Below 1,000 square meters
Total Employees
101 - 200 People
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