DB736
This product is a one-component, medium temperature fast heat curing modified epoxy resin adhesive. Excellent adhesion between many different types of materials. The product has excellent working performance, good high temperature resistance, low curing shrinkage, blister resistance, water boiling resistance and excellent sealing performance.
Send Inquiry to This Supplier
You May Also Like
-
DOCBOND|UV Cure AdhesiveNegotiableMOQ: 50 Bags
-
DOCBOND|Conductive AdhesiveNegotiableMOQ: 50 Bags
-
DOCBOND|UV Cure Liquid SealantNegotiableMOQ: 50 Bags
-
DOCBOND|Acrylic Thermally Conductive AdhesiveNegotiableMOQ: 50 Bags
-
DOCBOND|In-Mold Injection AdhesiveNegotiableMOQ: 50 Bags
-
DOCBOND|Fuel Cell Injection SealantNegotiableMOQ: 20 Pieces
-
DOCBOND|Metal Plate Bonding Gasket Bottom Coating AdhesiveNegotiableMOQ: 1 Bag
-
DOCBOND|Hydrogen Energy Humidifier Potting CompoundNegotiableMOQ: 20 Pieces
-
DOCBOND| SurfactantNegotiableMOQ: 20 Packs
-
DOCBOND|MEA Electrode Frame (five in One) AdhesiveNegotiableMOQ: 20 Units