- QINGDAO DOCBOND NEW MATERIAL CO.LTD
-
Qingdao, Shandong, China
- Main products: Water adhesive for fuel cell bipolar plate, sealant for gas path of fuel cell bipolar plate, microporous plugging agent for graphite bipolar plate, composite graphite bipolar plate
Home > Products > electronic glue > DOCBOND|Underfill DB840B
DOCBOND|Underfill DB840B
- Qingdao
- 7 days
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Product Details
| Brand Name | Underfill | Place of Origin | China | |
| Model Number | DB840B | Type | Underfill | |
| Classification | Hot Melt Adhesives | Usage | Other, High temperature waterproof seal | |
| Main Raw Material | Acrylic |
Product Description
DB840B
The Underfill is a one-component epoxy sealant for CSP or BGA underfill processes. It can form a consistent and non-defective underfill layer, which can effectively reduce the impact caused by mismatching of overall temperature expansion characteristics between the silicon chip and the substrate or external forces. Fast curing when heated. The lower viscosity characteristics allows for better underfilling; and good reworkability.
Contact Us
- QINGDAO DOCBOND NEW MATERIAL CO.LTD
- Contact nameKang Cheng Chat Now
- Phone86-0532-81700039
- Address628 Jiushui East Road，Laoshan District, Qingdao, Shandong
Product Categories
| electronic glue | Adhesive | bipolar plate |
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