0.4mm~6mm High Accuracy Full Automatic SMT Stencil Printer/ PCB Screen Printing Machine
0.4mm~6mm High Accuracy Full Automatic SMT Stencil Printer/ PCB Screen Printing Machine
Specs:
| PCB parameters | |
| Max board size | 450mm x 350mm |
| Min board size | 50mm x 50mm |
| PCB thickness | 0.4mm~6mm |
| Warpage | Max. PCB diagonal 1% |
| Max board weight | 6Kg |
| Board edge spacing | configuration to 3mm |
| Max bottom spacing | 20mm |
| Transmission speed | 1500mm/s(Max) |
| Transmission height to the land | 900±40mm |
| Transmission direction | Left-Right, Right-Left, Left-Left, Right-Right |
| Transmission method | One-stage transmission rail |
| PCB pick-up method | Software can change the elastic lateral pressure(Optional: multipoint on the bottom or partial vacuum or whole vacuum). |
| Board supporting method | Magnetic thimble, contour blocks, special workpiece fixture |
| Image parameters | |
| Field of view(FOV) | 6.4mm x 4.8mm |
| Table adjustable area | X,Y:±7.0mm θ:±2.0° |
| Reference point type | Standard reference point(see SMEMA standard),bonding pad/hole |
| Camera system | Individual camera, Up/down individual imaging visual system, geometric matching positioning |
| Performance parameters | |
| Imaging alignment repeated accuracy | ±12.5μ(±0.0005") @6 σ,Cpk≥2.0 |
| Printing repeated accuracy | ±25μ(±0.001") @6 σ,Cpk ≥ 2.0 |
| Cycle time | Less than 7.5s |
| Replace line time | Less than 5mins |
| Equipment | |
| Power | AC220V±10%,50/60HZ,15A |
| Compressed air | 4~6Kg/cm2, 10.0 tube |
| Operation system | Windows XP |
| Equipment size | 1140mm(L) x 1400mm(W) x 1480mm(H)( Do not include the screen and tri-color light height) |
| Equipment weight | About 1000kg |
The four-channel light source is adjustable, the intensity of the light source is adjustable, the illumination is uniform, and the collected images are more perfect, which can be well identified (including uneven Mark points), suitable for tin plating, copper plating, gold plating, tin spraying, FPC, and other types of PCBs in different colors.
The new type of wiping system ensures full contact with the steel mesh, and the enlarged vacuum suction force ensures that the residual solder paste in the mesh is eliminated vigorously, and the effective automatic cleaning function is truly realized.
Adaptive PCB thickness, software adjustable elastic side pressure and magnetic support device.
Intelligent programmable settings, independent, direct-connected motor-driven scraper, built-in precise pressure control system.
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