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A small magnetron sputtering coating instrument, which is characterized by its small size, It is used to deposit all kinds of metal and compound functional films on the surface of the Max.100mm wafer substrate.
Equipped with ONE 2-inch magnetron cathodes, it can be sputtered separately or two targets.
The sputtering modes include DC magnetron sputtering, DC reactive sputtering and RF magnetron sputtering. The process operation of the equipment is automatically controlled through the touch screen interface.
Vacuum Chamber: Ф300mm，Material is 304 stainless steel;
Turbo Molecular Pump: 600L/S，CF150
2-inch magnetron cathode
Magnetic target baffle
DC power supply:1KW
RF power supply: 600W
Substrate rotating table, substrate 4 inch Maximum
Substrate heating system: 400℃ Maximum
Air circuit solenoid isolation valve
Mass Flowmeter，Ar, N2/02
Cooling water separator
Electric Control System:Touch screen, control software
Rotating substrate table: substrate heating: room temperature ~ 400 ℃ ± 1 ℃, PID control.
Rotation speed: 0-30rpm, continuously adjustable.
Vacuum degree: limit vacuum degree: less than 5X10-4Pa
Magnetron sputtering power supply: 1 X1000w DC power supply, 1X600w RF power supply
Sputtering vacuum chamber: system reaction chamber: Ф300XH300 (subject to the actual design), the rear part is connected with the transfer chamber, and there is a DG150 flange interface on the side to install the turbo molecular pump air extraction system.
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