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Home > Manufacturing & Processing Machinery > Laser Equipment > Laser Cutting Machine > UV Picosecond Laser Cutter Machine PCB/Ceramic/Sillicon/Teflon Cutting
UV Picosecond Laser Cutter Machine PCB/Ceramic/Sillicon/Teflon Cutting
US$ 214290 - 520000
MOQ: 1 Set
Key Specifications
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Brand Name:
LJK
Place of Origin:
China
Certification:
ISO
Payment & Shipping
Payment Methods:
Port of Shipment:
Guangzhou,China
Delivery Detail:
20 days
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Brand Name
LJK
Place of Origin
China
Certification
ISO
After-sales Service Provided
Engineers available to service machinery overseas
Condition
New
Graphic Format Supported
AI, BMP, DST, DWG, DXF, PLT
Cooling Mode
Water Cooling
CNC or Not
Yes
Applicable Material
Other, Acrylic, Crytal, Glass, Metal, Paper, plastic, Plexiglax, siilicon,teflon,ceramic,PCB
Laser Type
Fiber Laser
PRODUCT FEATURES
1. Compared to nano laser equipment, pico laser significantly reduces the heat effected area, which is better for precision processing.
2. The processing surface is smoother.
3. Apart from PCB processing, pico equipment can also be used in ceramic, silicon, teflon, etc.
PRODUCT PARAMETERS
Item |
Specification |
Laser Type |
UV Pico Laser / 255nm |
Avg. Output Power |
>15w@200 KHz |
Scan Scope & Method |
Advanced 2D on the fly |
X-Y stage |
Split Stage, Coreless Linear Motor |
Panel Size |
650mm X 650mm |
Cutting Precision |
±10μm @avg |
Loader/Un-Loader |
Additional Option (Sheet to Sheet & Roll to Roll |
Power Supply |
220V, 3-phase, 50/60 Hz |
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Business Type
Manufacturer
Year Established
2007
Port of Shipment
Guangzhou, China
Main Markets
North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe, Central America, Northern Europe, Southern Europe, South Asia, Domestic Market
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